Integrated Thermal Management Substrate for Compact EV Cooling Layout

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Solution Overview

Problem

The existing thermal management systems for electric vehicles are complex, occupy large space, and reduce production and assembly efficiency due to the conventional arrangement of scattered components and excessive pipe parts.

Innovation Solution

A thermal management component and system that integrates a coolant flow channel into a substrate to replace water pipes, simplifying the layout design, reducing space occupation, and improving assembly efficiency by using a modular architecture with a coolant substrate and refrigerant substrate arranged in a stacking manner.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of stationary object

If conventional scattered component arrangement is used, then thermal management function is achieved, but space occupied by the system increases and assembly efficiency decreases

Engineering Contradiction:

Improvespace occupied by thermal management systemVSAvoidassembly efficiency

Core Design Contradiction:

Volume of stationary objectVSProductivity

Solution Approach 1:

The patent merges multiple thermal management components (water pipes, heat exchangers, valves, tanks) into a single integrated substrate structure. The substrate integrates coolant flow channels, refrigerant flow channels, and component mounting interfaces, eliminating the need for separate scattered components and reducing overall system volume while improving assembly efficiency.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent transitions from a three-dimensional scattered arrangement of components to a planar two-dimensional substrate integration. By laying out flow channels and component interfaces on a flat substrate surface, the system achieves compact integration while maintaining all necessary thermal management functions.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Device complexity

If conventional scattered component arrangement is used, then thermal management function is achieved, but layout design complexity increases

Engineering Contradiction:

Improvelayout design complexityVSAvoidproduction efficiency

Core Design Contradiction:

Device complexityVSEase of manufacture

Solution Approach 1:

The patent combines multiple complex layout elements (coolant pipes, refrigerant pipes, mounting brackets, connection interfaces) into a single unified substrate design. This integration dramatically simplifies layout design complexity while improving manufacturability through standardized substrate production processes.

Inventive Principle:

Principle #5Merging (Combining)

3Loss of energy

If redundant pipe parts are used, then thermal management coverage is achieved, but residual heat is wasted

Engineering Contradiction:

Improveresidual heat wasteVSAvoidpipe parts quantity

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

The patent merges coolant flow channels and refrigerant flow channels into the same substrate structure, enabling efficient heat exchange between the two fluid streams. This integration eliminates redundant pipe connections and optimizes heat transfer pathways, reducing residual heat waste while simplifying the overall pipe network.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The substrate acts as an intermediary heat exchange medium between the coolant system and refrigerant system. By providing direct thermal coupling through the substrate material, the patent enables efficient heat transfer without requiring extensive pipe networks, thereby reducing energy loss.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces the space occupied by the thermal management system, improves assembly efficiency, and enhances thermal energy recovery rates by preventing waste of residual heat, thus addressing the complexity and space issues of conventional systems.

Implementation Method 1

a coolant flow channel is integrated into a substrate, to replace a water pipe... implement comprehensive thermal management on the passenger compartment loop, the electric drive system loop, and the battery loop

Methodology Applied

Scientific EffectHeat transfer: Conduction (thermal)

Data Source

PatentUS20250050727A1Thermal management component and system, and vehicle

Publication Date: 2025.02.13 YINWANG INTELLIGENT TECHNOLOGIES CO LTD

AI summary

A thermal management component is provided, including a first substrate (111) and a second substrate (112). The first substrate (111) is provided with at least seven interfaces. The first substrate (111) is provided with at least seven flow channels. The at least seven flow channels communicate with the at least seven interfaces. The first substrate (111) is provided with a control valve. The control valve is configured to control communication between the at least seven flow channels to control communication between the at least seven interfaces. The second substrate (112) is disposed on a first side of the first substrate (111). The second substrate (112) is provided with through holes corresponding to the interfaces disposed on the first side of the first substrate (111). The interfaces disposed on the first side of the first substrate (111) respectively pass through the corresponding through holes. A thermal management system and a vehicle are further disclosed.