Thermal switch
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Solution Overview
Problem
Current cryostats face high operating costs due to continuous evaporation of cryogenic fluids, and existing thermal switches are ineffective at ultra-low temperatures, leading to heat leaks and inefficient thermal management in vacuum chambers, particularly in milli-Kelvin environments.
Innovation Solution
A mechanical thermal switch apparatus comprising a first thermal device, a second thermal device, and a deformable connection element with an anti-stick coating, which can establish and break mechanical contact to thermally isolate temperature stages within a vacuum chamber, utilizing a displacement mechanism to manage heat transfer effectively across different temperature zones.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a mechanical thermal switch is used to thermally isolate temperature stages, then heat input into the vacuum chamber is reduced, but the device becomes more complex and difficult to operate at ultra-low temperatures
Solution Approach 1:
The thermal switch is divided into separate functional components: a first thermal device, a second thermal device, and a connection element. This segmentation allows each component to be optimized for its specific function and facilitates maintenance or replacement of individual parts without affecting the entire system.
Solution Approach 2:
The connection element acts as an intermediary component that mechanically and thermally couples the first and second thermal devices. This intermediary structure enables controlled thermal isolation while maintaining mechanical stability, solving the complexity issue by providing a dedicated interface component.
2Reliability
If existing thermal switches are used at ultra-low temperatures, then thermal isolation is achieved, but heat leaks occur and switching efficiency decreases
Solution Approach 1:
The connection element is designed with deformable geometry and variable diameter, allowing it to change its thermal conductivity parameter in response to temperature changes. This enables the switch to maintain effective thermal isolation across ultra-low temperature ranges while minimizing heat leaks through parameter adaptation.
Solution Approach 2:
The apparatus employs composite material construction in the connection element, combining materials with different thermal properties to achieve both mechanical strength and controllable thermal isolation. This composite approach allows optimization of thermal isolation effectiveness while managing heat transfer characteristics.
3Adaptability or versatility
If the connection element is made deformable with variable diameter, then thermal switching capability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The connection element incorporates dynamic characteristics through its deformable structure and variable diameter design, allowing it to adapt its geometry during operation. This dynamic capability enables effective thermal switching while the design accounts for manufacturing tolerances through its adaptive nature.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus significantly reduces heat input into vacuum chambers, enabling operation at ultra-low temperatures by providing a high switching ratio and minimizing heat leaks, thus extending the operational range of mechanical thermal switches to sub-Kelvin temperatures.
Implementation Method 1
The connection element is configured to mechanically and thermally connect the first thermal device and the second thermal device
Implementation Method 2
a deformable connection element with an anti-stick coating, which can establish and break mechanical contact to thermally isolate temperature stages
Data Source
AI summary
An apparatus is provided that includes a first thermal device; a second thermal device: and a connection element configured to connect the first thermal device to the second thermal device.