Thermal Switching Conduction Path for Reversible Heat Dissipation
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Solution Overview
Problem
Conventional heat removal methods for electrical components are often bulky, expensive, and require permanent attachment, making them unsuitable for applications where compactness, reliability, and flexibility are essential, especially in environments like space where temperature fluctuations occur.
Innovation Solution
A heat dissipation switch using a layer of thermally isolating material with conductive element cavities and thermally switched conductive elements that deform in response to temperature changes to create or eliminate a heat flow path between a heat source and a heat sink, allowing for selective heat transfer only during operational periods of excess heat generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat source is continuously thermally coupled to a heat sink, then heat is continuously removed from the heat source, but heat or cold may undesirably flow in a reverse direction from the ambient environment to the electrical component during times in which the component is not producing excess heat
Solution Approach 1:
The patent employs a dynamic thermal coupling mechanism where the heat dissipation switch actively connects or disconnects the heat source from the heat sink based on real-time temperature conditions. This dynamic control prevents reverse heat flow by breaking the thermal path when the heat source is not generating excess heat, while maintaining continuous heat removal capability when needed.
Solution Approach 2:
The heat dissipation switch operates autonomously by sensing temperature changes and automatically adjusting the thermal coupling state without external control. The switch responds to temperature thresholds, connecting the heat source to the heat sink when temperature exceeds the threshold and disconnecting when it falls below, thereby self-regulating the heat flow direction and preventing reverse heat flow.
2Temperature
If conventional heat exchangers with coolant circulation are used, then effective heat removal is achieved, but the system becomes bulky and expensive with potential reliability issues due to required pumps or actuators
Solution Approach 1:
The patent extracts the active control components (pumps, actuators, coolant circulation systems) from the heat exchanger design, replacing them with a passive solid-state heat dissipation switch. This extraction eliminates the bulky and complex moving parts while retaining the essential heat removal function through direct solid-to-solid thermal coupling controlled by the switch's temperature-responsive mechanism.
Solution Approach 2:
The patent replaces the mechanical coolant circulation system with a solid-state thermal conduction-based heat dissipation switch. The switch uses temperature-responsive material properties (such as phase change or thermal expansion) to control heat flow, substituting mechanical pumps and fluid circulation with a solid-state device that has no moving parts, thereby reducing complexity and improving reliability.
3Temperature
If conventional heat exchange systems are incorporated during design phase, then heat removal capability is established, but flexibility for customization and supplementation after production is limited
Solution Approach 1:
The heat dissipation switch enables dynamic addition or modification of heat removal capabilities after the heat source is in production. The switch can be independently installed or customized for specific heat sources without redesigning the entire system, allowing flexible adaptation to changing thermal requirements through simple attachment or configuration changes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a compact, cost-effective, and reliable means to manage heat dissipation dynamically, minimizing weight and maintenance needs, and can be customized for specific applications, effectively addressing the limitations of traditional heat removal systems.
Implementation Method 1
The thermally switched conductive elements may be configured to deform in response to a threshold temperature
Implementation Method 2
a layer of thermally isolating material having a number of conductive element cavities
Implementation Method 3
thermally switched conductive elements may be positioned within the conductive element cavities
Data Source
AI summary
The disclosure herein provides for heat dissipation switches and systems, as well as their use for dissipating excess heat from a heat source. Various aspects of a heat dissipation switch may include a thermally isolating material having a number of conductive element cavities. A number of thermally switched conductive elements may nest within the conductive element cavities either independently or as part of a thermally switched sheet. The material of the thermally switched conductive elements may be configured to deform in response to a temperature change through a threshold temperature or temperature range in order to create or interrupt heat flow paths from the heat source to a heat sink.