Thermal Management via Task Scheduling in Computing Systems
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Solution Overview
Problem
Existing thermal management techniques for computing systems, such as heat sinks and software throttling, are inefficient and can impact processing speed, failing to effectively prevent overheating and damage to computer chips due to thermal hot spots.
Innovation Solution
A method of scheduling operations based on thermal attributes, which estimates the heat generated by each operation and allocates tasks among processing devices to maintain thermal thresholds, using a scheduler to manage operations between 'hot' and 'cool' queues to prevent overheating without impacting processing speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional thermal management techniques (heat sinks, fans) are used, then thermal hot spots are addressed, but system complexity and space requirements increase
Solution Approach 1:
The patent replaces mechanical thermal management systems (heat sinks, fans) with a software-based scheduling system that dynamically assigns tasks to processing devices based on real-time temperature conditions, thereby eliminating the need for additional mechanical cooling components
Solution Approach 2:
The processing system monitors its own thermal conditions and automatically adjusts task allocation to prevent overheating, enabling the system to self-regulate temperature without external mechanical intervention
2Temperature
If software throttling is used to manage thermal hot spots, then overheating is prevented, but processing speed is reduced
Solution Approach 1:
The patent implements dynamic task scheduling that continuously adapts to changing thermal conditions by assigning tasks to different processing devices based on real-time temperature status, allowing the system to maintain high processing speeds while preventing overheating through flexible, real-time adjustments rather than static throttling
Solution Approach 2:
The patent divides processing tasks into different categories (thermal attributes) and distributes them across multiple processing devices based on current thermal conditions, allowing computationally intensive tasks to be executed on cool devices while hot devices are given lighter tasks or idle time
3Measurement precision
If temperature sensors are placed close to hot spots for accurate monitoring, then thermal detection precision is improved, but device complexity increases
Solution Approach 1:
The patent utilizes existing performance monitoring infrastructure to simultaneously track both performance metrics and temperature conditions, allowing the same monitoring system to serve multiple functions without requiring dedicated temperature sensors near hot spots
Data Source
AI summary
The present invention provides apparatus and methods to perform thermal management in a computing environment. In one embodiment, thermal attributes are associated with operations and/or processing components, and the operations are scheduled for processing by the components so that a thermal threshold is not exceeded. In another embodiment, hot and cool queues are provided for selected operations, and the processing components can select operations from the appropriate queue so that the thermal threshold is not exceeded.