Thermally Conductive Testing Jig for Laser Burn-In Accuracy
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Solution Overview
Problem
Current optical module testing methods face challenges in accurately screening out lasers with early failures or performance deficiencies due to temperature differences between measured and actual laser temperatures, which are typically greater than 5 degrees Celsius.
Innovation Solution
A testing jig with thermally conductive components that directly contact the circuit board and heat sources, coupled to a housing, to uniformly distribute heat and reduce temperature differences to within 1.5 degrees Celsius, combined with a method to selectively switch heat source channels based on temperature values to achieve a difference of 0.5 degrees Celsius.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional testing methods are used without direct thermal coupling, then the testing setup is simpler, but the temperature measurement precision is insufficient with differences greater than 5 degrees Celsius
Solution Approach 1:
The patent introduces a thermally conductive component as an intermediary between the heat source and the temperature sensor. This mediator transfers thermal energy from the heat source to the sensor, enabling accurate temperature measurement of the heat source without direct contact. The thermally conductive component resolves the contradiction by providing a simple thermal coupling mechanism that improves measurement precision without significantly increasing device complexity.
Solution Approach 2:
The patent replaces complex mechanical thermal coupling systems with a simpler thermal conduction approach through the thermally conductive component. Instead of using complex mechanical contact systems or active cooling/heating mechanisms, the invention uses passive thermal conduction to achieve temperature equalization and accurate measurement, thereby reducing device complexity while improving measurement precision.
2Reliability
If heat is uniformly distributed without selective switching, then the thermal field is more stable, but the ability to screen out defective lasers is reduced
Solution Approach 1:
The patent implements dynamic control of the thermal field by selectively switching heat source channels on and off based on real-time temperature feedback. This dynamic adjustment allows the system to stabilize the thermal field for measurement while still being able to screen out defective lasers by isolating specific channels. The dynamic switching mechanism enables the system to adapt between stable thermal conditions and defect detection modes.
Solution Approach 2:
The patent segments the heat source into multiple independent channels, allowing selective activation of specific channels during testing. This segmentation enables the system to isolate and test individual laser elements separately, improving defect detection reliability while maintaining overall thermal field stability through controlled activation of specific segments.
3Measurement precision
If temperature sensors are placed far from heat sources, then the measurement is less affected by local heat concentration, but the temperature difference becomes too large (>5°C) for accurate screening
Solution Approach 1:
The patent uses a thermally conductive component as an intermediary to bridge the gap between the heat source and the temperature sensor. This mediator conducts heat from the heat source to the sensor, allowing the sensor to be positioned at a convenient location while still measuring the heat source temperature accurately. The thermal conduction path eliminates the large temperature difference that would otherwise exist due to distance, achieving both measurement precision and appropriate temperature differential for screening.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Accurately screens out lasers with early failures or performance deficiencies by reducing temperature discrepancies to 0.5 degrees Celsius, ensuring reliable burn-in testing.
Implementation Method 1
The at least one thermally conductive component is disposed on and thermally coupled to the housing, and at least part of the at least one thermally conductive component is located in the circuit board accommodation space. The at least one thermally conductive component is capable of contacting with the circuit board and thermally coupled to the heat source.
Data Source
AI summary
A testing jig and method for testing at least one circuit board assembly are provided. The testing jig includes a housing and at least one thermally conductive component. The housing has a circuit board accommodation space. The thermally conductive component is disposed on and thermally coupled to the housing and at least partially located in the circuit board accommodation space. The thermally conductive component is capable of contacting a circuit board and thermally coupled to a heat source.