Thermal testing system having safety feature(s) and multiple independently controlled thermoelectric coolers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional thermal testing systems with fixed voltage thermoelectric coolers limit the temperature range over which devices can be tested, potentially damaging devices due to excessive heating or cooling, and require separate testing under different conditions, increasing costs and labor.
Innovation Solution
Implementing variable voltage sources to independently control multiple thermoelectric coolers, allowing for adjustable temperature differentials across each cooler, enabling simultaneous testing of multiple devices under different thermal conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a pre-defined fixed voltage is used to control the thermoelectric cooler, then the system structure is simple, but the temperature range is limited and device performance may be negatively affected
Solution Approach 1:
The patent applies dynamics by replacing the fixed voltage source with a variable voltage source that can dynamically adjust the voltage level based on the desired temperature differential. This allows the thermoelectric cooler to adapt to different testing requirements while maintaining a relatively simple system structure.
Solution Approach 2:
The patent implements parameter changes by enabling the voltage parameter to be variable rather than fixed. The variable voltage source can change the voltage amplitude to control the temperature differential across the thermoelectric cooler, thereby expanding the temperature range without significantly increasing system complexity.
2Device complexity
If a fixed heat differential is applied to the device under test, then the control system is simple, but the device may become too hot or too cold affecting performance and reliability
Solution Approach 1:
The patent applies feedback by implementing a control system that monitors the temperature differential across the thermoelectric cooler and adjusts the voltage accordingly. This feedback mechanism ensures the device under test operates within safe temperature ranges, preventing overheating or excessive cooling that would affect performance and reliability.
Solution Approach 2:
The control system becomes dynamic by continuously adjusting the voltage to the thermoelectric cooler based on real-time temperature conditions, rather than applying a fixed heat differential. This dynamic control maintains device reliability while keeping the control system relatively simple.
3Measurement precision
If separate testing under different thermal conditions is required, then each test condition can be optimized, but the testing cost and labor increase
Solution Approach 1:
The patent implements universality by designing a single thermal testing system that can perform multiple testing functions under different thermal conditions. The variable voltage source enables the system to test multiple devices simultaneously at different temperatures, eliminating the need for separate testing setups and significantly improving productivity while maintaining test condition optimization.
Solution Approach 2:
The patent applies segmentation by dividing the thermal testing into multiple independent zones, each with its own thermoelectric cooler controlled by variable voltage sources. This allows different temperature conditions to be applied to different devices simultaneously within the same system, enabling parallel testing that improves efficiency while maintaining precise control over each test condition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances testing efficiency by reducing device failure, expanding the temperature range, and minimizing labor and replacement costs by allowing precise temperature control and simultaneous testing of multiple devices.
Implementation Method 1
Each of the thermoelectric coolers is configured to have a temperature differential between the first and second opposing surfaces of the respective thermoelectric cooler, which is caused by a Peltier effect, based on a respective input voltage
Implementation Method 2
Each first heat exchanger is configured to transfer heat between a respective subset of the thermoelectric coolers and a fluid
Data Source
Figure 1
Figure 2
Figure 3
AI summary
Techniques are described herein that are capable of using variable voltage sources to control respective thermoelectric coolers independently in a thermal testing environment. The variable voltage sources create temperature differentials between first and second opposing surfaces of the thermoelectric coolers by applying input voltages to the respective thermoelectric coolers. Heat is transferred, by first heat exchanger(s), between a fluid and respective subset(s) of the thermoelectric coolers Heat is transferred, by second heat exchanger(s), between semiconductor device(s) and the subset(s) of the thermoelectric coolers.