Thermal Throttling Peripheral Components Processing Device

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Solution Overview

Problem

Conventional thermal throttling techniques for processing devices, which modulate the CPU to prevent overheating, result in disproportionate performance degradation and underutilization of resources, especially in devices where the CPU contributes a small fraction of the overall thermal output.

Innovation Solution

A method and system for thermal management that determines if a die temperature exceeds a threshold, selectively implements thermal reduction processes on peripheral components before the CPU, using a thermal diode and thermal throttling module to manage thermal output, prioritizing peripheral components based on criticality and thermal output, and adjusting operational modes to reduce thermal energy without degrading performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the CPU is throttled to reduce thermal output, then the temperature of the processing device is reduced, but the overall performance of the processing device is severely degraded

Engineering Contradiction:
Improveprocessing device temperatureVSAvoidprocessing device performance
Core Design Contradiction:
TemperatureVSProductivity

Solution Approach 1:

The patent segments the processing device into distinct components (CPU and peripheral components) with separate thermal throttling controls. The thermal throttling module can selectively throttle peripheral components while maintaining CPU performance, or throttle the CPU as a last resort. This segmentation allows targeted thermal management that reduces overall thermal output without severely degrading overall processing performance.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent implements local quality by applying different throttling strategies to different components based on their thermal contribution and performance criticality. Peripheral components that contribute significantly to thermal output but are less critical to overall performance are throttled first, while the CPU maintains full performance until necessary. This localized approach optimizes the balance between thermal reduction and performance maintenance.

Inventive Principle:
Principle #3Local quality

2Temperature

If the CPU performance is reduced to manage thermal output, then thermal parameters are normalized, but processing resources are underutilized

Engineering Contradiction:
Improveprocessing device thermal parametersVSAvoidprocessing resource utilization
Core Design Contradiction:
TemperatureVSProductivity

Solution Approach 1:

The patent implements preliminary action by establishing a hierarchy of throttling targets before thermal crisis occurs. The system is pre-configured to throttle peripheral components first (such as graphics processors, audio processors, or other co-processors) before considering CPU throttling. This preliminary arrangement ensures that when thermal management is needed, the most thermal-contributing but least performance-critical components are reduced first, preserving CPU resource utilization.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent applies dynamics by making the throttling strategy adaptive and changeable based on real-time conditions. The thermal throttling module dynamically adjusts which components are throttled and by how much, based on current thermal readings, component thermal contributions, and performance requirements. This dynamic approach allows the system to maintain optimal resource utilization while managing thermal parameters.

Inventive Principle:
Principle #15Dynamics

3Reliability

If CPU throttling is applied whenever temperature approaches maximum limit, then thermal safety is ensured, but performance degradation is disproportionate to thermal reduction

Engineering Contradiction:
Improvethermal safetyVSAvoidperformance-to-thermal-reduction ratio
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent segments the thermal management approach into component-specific throttling zones. Instead of a monolithic CPU-throttle-all approach, the system identifies and throttles peripheral components that contribute disproportionately to thermal output. This segmentation enables more efficient thermal reduction per unit of performance sacrifice, as peripheral components often have higher thermal density relative to their performance contribution.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent changes the operational parameters of peripheral components (such as clock frequency, voltage, or operational mode) to reduce their thermal output while maintaining acceptable performance levels. By adjusting these parameters selectively on peripheral components rather than the CPU, the system achieves better thermal reduction efficiency with less impact on overall processing performance.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively reduces thermal output while minimizing performance degradation by throttling peripheral components before the CPU, maintaining optimal CPU operation and resource utilization, thus improving thermal management in processing devices.

Implementation Method 1

determining whether a temperature of a portion of a die of an integrated circuit device has exceeded a first temperature threshold

Methodology Applied
Scientific EffectThermal energy measurement: Thermal Radiation

Data Source

PatentUS8304698B1Thermal throttling of peripheral components in a processing device
Publication Date: 2012.11.06 GLOBALFOUNDRIES US INC
  • US8304698B1 patent drawing
  • US8304698B1 patent drawing
  • US8304698B1 patent drawing

AI summary

Whether a temperature of a portion of a die of an integrated circuit device having a central processing device and one or more peripheral components has exceeded a first temperature threshold is determined. In response to determining that the temperature of the portion of the die has exceeded the first temperature threshold, a first thermal reduction process for a first peripheral component of the one or more peripheral components is selected and the first thermal reduction process for the first peripheral component is implemented.