Thermal Transfer Assembly With Dual Heat Sinks and Airflow Cooling
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Solution Overview
Problem
Electronic devices generate heat during operation, which can lead to premature degradation and damage if not adequately dissipated, and existing cooling solutions may not effectively manage this without increasing system size or complexity.
Innovation Solution
A thermal transfer device comprising a first heat sink member with a plate and sidewalls, a second heat sink member with a plate, and a fan assembly that enhances heat dissipation by circulating cooling air across the surfaces of both heat sink members, allowing for efficient thermal conduction and convection without increasing system space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling solutions are used to dissipate heat from electronic components, then heat dissipation is achieved, but system size and complexity increase
Solution Approach 1:
The patent combines multiple heat dissipation mechanisms into a single integrated thermal transfer device. The first and second heat sink members are thermally connected to form a unified structure that conducts heat from the electronic component through multiple pathways simultaneously, eliminating the need for separate cooling components and reducing overall system complexity.
Solution Approach 2:
The thermal transfer device is segmented into multiple functional zones within a compact structure. The first heat sink member with its plate and sidewalls creates distinct thermal conduction pathways, while the second heat sink member provides additional dissipation surfaces. This segmentation allows efficient heat management without increasing the overall device footprint.
2Temperature
If larger cooling components are used to improve heat dissipation, then heat dissipation efficiency increases, but system space increases
Solution Approach 1:
The patent utilizes three-dimensional thermal conduction pathways by extending sidewalls from the first heat sink plate and positioning the second heat sink member at a different spatial location. This vertical and lateral dimensionality allows heat to dissipate through multiple surfaces simultaneously, achieving high heat dissipation efficiency within a compact volume without requiring larger planar surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively dissipates heat generated by electronic components, preventing damage and improving device longevity while maintaining system architecture and size.
Implementation Method 1
the first heat sink member and the second heat sink member being configured to be in thermal connection with each other at a contact area for thermally conducting heat from the first heat sink member to the second heat sink member
Implementation Method 2
the fan assembly being configured to direct cooling air across respective surfaces of the first heat sink member and the second heat sink member to increase a heat dissipation at the first heat sink member and the second heat sink member
Data Source
AI summary
A thermal transfer device for thermally conducting heat from a heat source includes a first heat sink member arranged at a first side and a second heat sink member arranged at a second side opposite the first side. The thermal transfer device includes a first plate, at least one sidewall extending towards the second side from the first plate, and a plurality of fins. The second heat sink member includes a second plate. The first heat sink member and the second heat sink member can be in thermal connection with each other at a contact area for thermally conducting heat from the first heat sink member to the second heat sink member. The second plate is configured to distribute heat thermally conducted from the first heat sink member throughout the second plate.