Thermal Transfer Modules for Electronic Cooling and Vibration Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current cooling methods for electronic systems, such as forced air convection, face challenges in densely packed enclosures due to increased heat generation and electromagnetic interference, while conduction cooling is hindered by rotational vibrations between disk drives in arrays, necessitating a method that maximizes thermal transfer and minimizes vibrational transmission.
Innovation Solution
A thermally conductive packaging technique involving thermal transfer media and shells surrounding heat sources, with exposed connection means, forming thermal transfer modules that can be placed in conductive cells, facilitating efficient heat exchange and mechanical isolation through the use of elastomeric materials with high thermal conductivity and vibrational damping properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If forced air convection cooling is used, then heat can be removed from electronic systems, but air gaps and electromagnetic interference increase
Solution Approach 1:
The patent introduces a thermally conductive packaging material as an intermediary between heat-generating electronic components and the external environment. This material conducts heat away from components while providing electromagnetic shielding, thus removing heat without allowing electromagnetic interference to propagate.
Solution Approach 2:
The patent replaces the mechanical forced air convection system with a solid-state thermal conduction system. Instead of using air flow and moving parts to remove heat, the invention uses thermally conductive packaging materials to conduct heat away, eliminating the need for air gaps and associated electromagnetic interference.
2Quantity of substance
If disk drives are densely packed in arrays, then storage capacity increases, but rotational vibrations between drives increase
Solution Approach 1:
The patent uses vibration-damping packaging materials as intermediaries between densely packed disk drives. These materials absorb and dampen rotational vibrations, preventing them from transmitting between adjacent drives while allowing the drives to be closely spaced for maximum storage capacity.
Solution Approach 2:
The patent employs composite packaging materials that combine thermal conduction properties with vibration damping characteristics. These composite materials simultaneously address heat removal and vibration isolation requirements, enabling dense drive arrays to operate reliably.
3Object-generated harmful factors
If physical isolation between disk drives is implemented, then vibrational transmission decreases, but packaging density decreases
Solution Approach 1:
The patent uses thin, flexible vibration-damping films and shells that can be placed between disk drives. These thin barriers provide effective vibration isolation without occupying significant space, thus maintaining high packaging density while reducing vibrational transmission between drives.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces temperature fluctuations and vibrational transmissibility, enhancing thermal transfer efficiency and system reliability by eliminating air gaps and noise associated with traditional cooling methods, while maintaining compact packaging and electromagnetic compatibility.
Implementation Method 1
A heat source is partially surrounded by a set of thermal transfer media. A set of thermal transfer shells partially surround the set of thermal transfer media. Thermal transfer sheets are placed in contact with both or either of the thermal transfer module and the thermally conductive cell, facilitating a heat exchange with an environment external to the thermal transfer module.
Implementation Method 2
the use of elastomeric materials with high thermal conductivity and vibrational damping properties
Data Source
AI summary
A method and apparatus for a thermally conductive packaging technique for cooling electronic systems. A heat source is partially surrounded by a set of thermal transfer media. A set of thermal transfer shells partially surround the set of thermal transfer media. The heat source connection means are left exposed and utilized for connection to the electronic system. The heat source, the set of thermal transfer media configured to partially surround the heat source, and the thermal transfer shell partially surrounding the set of thermal transfer media form a thermal transfer module. Thermal transfer modules may be placed in thermally conductive cells. A set of thermal transfer sheets are placed in contact with both or either of the thermal transfer module and the thermally conductive cell, facilitating a heat exchange with an environment external to the thermal transfer module.