Thermal Transfer Plate for 3D Semiconductor Package Heat Management
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Solution Overview
Problem
Semiconductor packages face challenges in effectively managing heat generated by densely packed semiconductor chips, leading to performance degradation due to inadequate heat radiation structures.
Innovation Solution
Incorporating a thermal transfer plate between semiconductor chips, which contacts the interconnection layer and overlaps with a first semiconductor chip, providing a heat radiation path using high thermal conductivity materials like copper or aluminum, and further enhancing cooling efficiency with a heat spreader and thermal interface material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor chips are densely packed to increase integration, then productivity and functionality are improved, but heat generation increases and cooling becomes more difficult
Solution Approach 1:
The patent introduces a thermal transfer plate that extends vertically through the package structure, transitioning heat management from a planar (2D) approach to a three-dimensional (3D) approach. The plate penetrates through multiple chip layers and interconnection layers, providing a vertical heat evacuation path that does not occupy horizontal space, thus enabling effective cooling in densely packed 3D configurations without increasing package footprint.
Solution Approach 2:
The thermal transfer plate acts as an intermediary component between heat-generating semiconductor chips and heat dissipation structures. It provides a dedicated thermal conduction path that mediates heat transfer from chips through interconnection layers to external heat sinks, preventing heat accumulation in the densely packed chip environment while maintaining electrical interconnection integrity.
2Reliability
If a thermal transfer plate is added to provide heat radiation path, then cooling efficiency is improved, but device complexity increases
Solution Approach 1:
The thermal transfer plate is designed to perform multiple functions simultaneously: it provides thermal conduction from chips to heat sinks, serves as a structural support element in the package, and can act as an electrical isolation layer between different chip interconnections. This multi-functionality reduces the need for separate dedicated components, thereby limiting the increase in overall device complexity while achieving effective heat management.
Solution Approach 2:
The patent employs composite material structures for the thermal transfer plate, combining materials with high thermal conductivity for heat transfer regions with materials providing appropriate mechanical and electrical properties in different zones. This allows optimization of thermal performance without proportionally increasing structural complexity, as the composite structure integrates multiple functions within a single component.
3Length of stationary object
If vertical overlap configuration is used to reduce package thickness, then compactness is improved, but heat dissipation path length increases
Solution Approach 1:
The patent resolves this contradiction by introducing vertical heat transfer pathways through the thermal transfer plate that penetrate through the stacked chip structure. Instead of relying solely on lateral heat dissipation (2D), the system utilizes the vertical dimension (3D) to create direct heat evacuation routes from upper chips through the thermal plate to external heat sinks, effectively managing heat in compact vertical configurations without proportionally increasing heat path length.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal transfer plate effectively transmits heat away from the semiconductor chips, preventing temperature rise and improving cooling efficiency, while also reducing package thickness and signal routing path lengths by allowing for vertical overlap and reduced chip spacing.
Implementation Method 1
The thermal transfer plate may provide a heat radiation path
Data Source
AI summary
A semiconductor package and a method of manufacturing the semiconductor package may be provided. The semiconductor package may include a first semiconductor chip disposed on a first surface of an interconnection layer, a second and a third semiconductor chips disposed on a second surface of the interconnection layer. The semiconductor package may include a thermal transfer plate disposed between the second and third semiconductor chips, contacting the second surface of the interconnection layer, and overlapping with the first semiconductor chip. The thermal transfer plate may be configured to provide a heat radiation path.