Thermal-Transfer Assembly Projections for Electrical Connector Heat Dissipation
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Solution Overview
Problem
Existing thermal-transfer assemblies for electrical connectors often cause damage to internal components due to the normal force exerted by thermal bridges, which is necessary for effective heat dissipation.
Innovation Solution
A thermal-transfer assembly comprising two modules with projections that interface in a mated arrangement to transfer thermal energy, along with an assembly clip that prevents separation and biases the modules away from each other, allowing for efficient heat transfer without excessive force on internal components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermal bridge is used to transfer thermal energy away from internal electronics, then heat dissipation is improved, but the normal force exerted on internal components increases causing damage
Solution Approach 1:
The thermal transfer assembly is divided into multiple discrete thermal transfer elements arranged in an array. Each element independently transfers thermal energy from internal electronics to the connector housing, distributing the thermal management function across multiple segments rather than relying on a single thermal bridge that would exert concentrated force on components.
Solution Approach 2:
The patent replaces the traditional mechanical thermal bridge (which relies on compression and normal force for thermal contact) with a array of thermal transfer elements that make intimate contact with internal electronics. This substitution eliminates the need for excessive normal force while maintaining effective thermal conduction through direct surface contact.
2Temperature
If thermal transfer elements are made to intimately engage internal electronics for effective heat transfer, then thermal conductivity is improved, but manufacturing precision requirements increase due to tolerances and component movement
Solution Approach 1:
The patent employs thermal transfer elements with compliant or flexible properties that can adapt to manufacturing tolerances and component position variations. By changing the mechanical parameters of the thermal transfer elements (such as making them compliant rather than rigid), the system maintains intimate thermal contact without requiring extremely tight manufacturing precision.
Solution Approach 2:
The thermal transfer elements are designed to be dynamic rather than static, allowing them to adjust their position and contact pressure in response to manufacturing tolerances and component movement during operation. This dynamic adaptation ensures continuous intimate engagement for effective thermal transfer without being constrained by fixed precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively transfers thermal energy away from internal electronics while reducing the likelihood of damage to the components, maintaining intimate engagement and thermal conductivity even with manufacturing tolerances and component movement.
Implementation Method 1
The first and second projections project in opposite directions along a Z-axis and intimately engage one another to transfer thermal energy therebetween
Data Source
AI summary
Thermal-transfer assembly includes a first transfer module having a plurality of first projections. The first projections are spaced apart from one another to form corresponding gaps therebetween. The thermal-transfer assembly also includes a second transfer module having a plurality of second projections. The second projections are spaced apart from one another to form corresponding gaps therebetween. The first and second transfer modules interface with each other in a mated arrangement. The first and second projections project in opposite directions along a Z-axis and intimately engage one another to transfer thermal energy therebetween. The thermal-transfer assembly also includes an assembly clip coupled to and configured to engage each of the first and second transfer modules. The assembly clip prevents the first and second transfer modules from separating along the Z-axis and/or biases the first and second transfer modules away from each other along the Z-axis.