Thermal Transfer Substrate for Touch Display Yield
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Solution Overview
Problem
The manufacturing yield rate of touch display panels is low due to damage caused by directly forming the touch layer on the thin film encapsulation layer during the manufacturing process, which is a challenge in flexible display technology.
Innovation Solution
A thermal transfer substrate is introduced, featuring a touch module with adhesive properties that decrease under a first condition and increase under a second condition, allowing for detachment from a base substrate and attachment to a thin film encapsulation layer without direct etching on the encapsulation layer, thereby preventing damage and improving yield rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the touch layer is directly formed on the thin film encapsulation layer through patterning process, then the touch display panel can be manufactured with on-cell structure, but the thin film encapsulation layer is damaged causing low manufacturing yield rate
Solution Approach 1:
The patent introduces a thermal transfer substrate as an intermediary carrier between the base substrate and the thin film encapsulation layer. The touch module is first formed on the thermal transfer substrate, then transferred to the final position on the thin film encapsulation layer. This intermediary approach prevents direct contact between the patterning process and the encapsulation layer, eliminating damage while maintaining the on-cell structure.
2Ease of manufacture
If the touch module is formed on the base substrate with adhesive properties, then the touch module can be detached and transferred, but the adhesive property changes require specific condition control
Solution Approach 1:
The patent utilizes temperature-dependent adhesive properties of the buffer layer. At a first temperature condition, the adhesive force is strong for bonding; at a second temperature condition, the adhesive force weakens for easy detachment. This parameter change allows controlled transfer of the touch module without requiring complex adhesive switching mechanisms.
Solution Approach 2:
The buffer layer undergoes a phase transition or property change in response to temperature variations. The material transitions from a high-adhesion state during bonding to a low-adhesion state during detachment, enabling the transfer process through thermal control rather than mechanical or chemical methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the manufacturing yield rate of touch display panels by preventing damage to the thin film encapsulation layer during the formation of the touch module, ensuring a higher quality and reliability of flexible display panels.
Implementation Method 1
a side of the touch module which is in contact with the base substrate is adhesive, and the adhesiveness decreases under a first condition while increases under a second condition
Data Source
AI summary
Disclosed is a thermal transfer substrate including a base substrate and a touch module on the base substrate. A side of the touch module which is in contact with the base substrate is adhesive, the adhesiveness decreasing under a first condition while increasing under a second condition. The present disclosure solves the problem that the manufacturing yield rate of touch display panels is relatively low, and improves the manufacturing yield rate of the touch display panels. The present disclosure is used for manufacturing a touch display panel.