Thermal Transient Simulation for Structure Function Mapping

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Current thermal analysis methods, such as thermocouples, are prone to errors and cannot accurately measure internal temperature distributions or calibrate thermal models due to limitations in temperature measurement and heat flow path identification, making them inadequate for precise thermal design verification.

Innovation Solution

A method involving thermal transient response simulation to map thermal model elements to a structure function based on a single simulation, determining onset times and resistance values, and associating these with specific model elements to calibrate thermal models, using a Zth(t)-curve and experimental measurements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If thermocouples are used to measure temperature at contact points, then temperature measurement is possible, but measurement precision deteriorates due to temperature distribution at the package case and insufficient insulation

Engineering Contradiction:

Improvetemperature measurement accuracyVSAvoidmeasurement reproducibility

Core Design Contradiction:

Measurement precisionVSReliability

Solution Approach 1:

The patent introduces thermal simulation as an intermediary tool to map thermal model elements to structure functions. Instead of directly measuring temperature with thermocouples, the system uses simulated thermal transient response data to identify and characterize thermal resistances and capacitances, thereby avoiding the measurement errors inherent in direct thermocouple contact.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent creates a virtual thermal model that copies the physical package's thermal behavior. By simulating the thermal transient response and generating structure functions, the system replicates the thermal characteristics without physical contact, eliminating issues with thermocouple insulation and contact point temperature distribution.

Inventive Principle:

Principle #26Copying

2Measurement precision

If thermocouples are used for direct temperature measurement, then temperature data is obtained, but the ability to measure internal structure temperature deteriorates

Engineering Contradiction:

Improveinternal temperature measurement capabilityVSAvoidmeasurement system complexity

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The patent replaces the mechanical thermocouple measurement system with a computational thermal simulation system. Instead of physically inserting thermocouples into internal structures, the system uses simulated thermal transient response data to extract internal thermal characteristics, thereby accessing internal temperature information without physical intrusion.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Measurement precision

If multiple simulations are performed to map thermal model elements to structure functions, then mapping accuracy improves, but computational expense increases

Engineering Contradiction:

Improvethermal model mapping accuracyVSAvoidcomputational expense

Core Design Contradiction:

Measurement precisionVSUse of energy by stationary object

Solution Approach 1:

The patent performs a single thermal transient response simulation rather than multiple simulations, achieving sufficient mapping accuracy between thermal model elements and structure functions. This partial action approach (one simulation instead of many) reduces computational expense while maintaining adequate precision for thermal model calibration.

Inventive Principle:

Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for accurate identification of thermal resistances and capacitances within electronic packages and external components, enabling precise calibration of thermal models with reduced computational expense compared to traditional methods.

Implementation Method 1

The thermal transient response simulation determines a relation between transient thermal impedance of the structure and time and a relation between maximum temperature change of each of the thermal model elements and time

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

In a thermal transient measurement, a step power is applied to a structure of interest and the response of the structure is recorded and analyzed

Methodology Applied

Scientific EffectThermal transient response:

Data Source

PatentUS10571514B2Single simulation-based structure function mapping

Publication Date: 2020.02.25 SIEMENS INDUSTRY SOFTWARE INC

AI summary

A thermal transient response simulation is performed for a structure having a plurality of thermal model elements. The thermal transient response simulation determines a relation between transient thermal impedance of the structure and time and a relation between maximum temperature change of each of the thermal model elements and time. An onset time at which energy reaches each of the thermal model elements is determined based on the relation between maximum temperature change of each of the thermal model elements and time and a predetermined maximum temperature change threshold. An influence onset resistance value for each of the thermal model elements is determined by looking up a thermal resistance value corresponding to the onset time based on the relation between transient thermal impedance of the structure and time. A structural function is mapped based on the influence onset resistance value for each of the thermal model elements.