Thermal Tube Assembly for Electronic Heat Dissipation
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Solution Overview
Problem
Existing cooling systems for electronic components, particularly in complex and high-density systems like SSDs and DIMMs, are inefficient, noisy, expensive, and fail to effectively dissipate localized heat, leading to reduced performance and potential failure.
Innovation Solution
An electronic assembly is formed by mechanically coupling circuit boards to assembly rails to create a thermal channel through which airflow can pass, directing it over heat-generating components to enhance heat dissipation, using airflow tabs and strategically arranging components to improve airflow dynamics and separate heat-sensitive components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple heat sinks and high-speed fans are used for cooling, then heat dissipation capability is improved, but system noise increases
Solution Approach 1:
The patent combines multiple heat sinks into a single integrated heat sink structure that serves multiple components simultaneously. This merging reduces the number of separate cooling components needed, thereby reducing system noise while maintaining effective heat dissipation across multiple heat-generating components.
Solution Approach 2:
The integrated heat sink structure is designed to serve multiple functions: it cools multiple different components (processors, memory modules, etc.) simultaneously and works effectively with various airflow rates. This multi-functional design eliminates the need for multiple specialized heat sinks and high-speed fans, reducing noise while maintaining cooling effectiveness.
2Temperature
If multiple heat sinks and high-speed fans are used for cooling, then heat dissipation capability is improved, but energy consumption increases
Solution Approach 1:
By merging multiple heat sinks into a single integrated structure, the system reduces the number of high-speed fans needed to drive airflow. This consolidation allows for more efficient airflow management and reduces the total energy consumption of the cooling system while maintaining adequate heat dissipation.
Solution Approach 2:
The universal heat sink design that can cool multiple components simultaneously reduces the overall cooling capacity needed from individual fans, thereby reducing total energy consumption. The system achieves effective cooling with lower power consumption by optimizing the airflow path through the integrated structure.
3Temperature
If multiple heat sinks and high-speed fans are used for cooling, then heat dissipation capability is improved, but system cost increases
Solution Approach 1:
The patent integrates multiple heat sink functions into a single structural component, reducing the total number of parts that need to be manufactured, assembled, and maintained. This merging significantly reduces system cost while maintaining the ability to dissipate heat from multiple components effectively.
4Temperature
If traditional cooling systems are used, then general cooling is provided, but localized hot-spots are not alleviated
Solution Approach 1:
The integrated heat sink structure incorporates locally optimized thermal management features, including varying thickness regions and strategically placed heat dissipation surfaces that target specific hot-spot areas. This local quality approach ensures that localized hot-spots are effectively addressed while maintaining general cooling across the entire system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively carries away heat generated by electronic components, maintains low temperature increases, and reduces thermal expansion, improving the longevity and performance of electronic components while being more efficient and cost-effective than traditional cooling methods.
Implementation Method 1
When airflow passes along a pathway through the channel, it flows over surfaces of electronic components mounted on the circuit boards and at least partially carries-away heat generated by these components
Data Source
Figure 1
Figure 2A~2B
Figure 3A~3D
AI summary
Various embodiments described herein disclose systems, methods and/or devices used to dissipate heat generated by electronic components of an electronic assembly that further includes a first assembly rail, a top circuit board and a bottom circuit board. The first assembly rail includes a first card guide structure and a second card guide structure that are arranged on a first side of the first assembly rail near two opposite ends of the assembly rail. The top and the bottom circuit boards are mechanically coupled to the first and second card guide structures of the first assembly rail, respectively. The top circuit board is parallel to the bottom circuit board, and separated from the bottom circuit board by a predefined distance. The first assembly rail, the top circuit board and the bottom circuit board together form a channel therebetween for receiving a heat dissipating airflow.