Thermal Via Heat Dissipation in Substrate-Mounted Semiconductor Chips
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Solution Overview
Problem
Miniaturized electronic apparatuses face challenges in effectively radiating heat generated by high-frequency semiconductor chips due to the placement of antennas and heat-radiating members, which limits the use of thermal interface materials and affects mountability.
Innovation Solution
The electronic apparatus incorporates a second substrate with thermal vias and a resin material containing inorganic fillers, such as aluminum nitride, to efficiently radiate heat without compromising mountability, using a mold resin between substrates to facilitate heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat-radiating member is provided on the face of the substrate opposite to the semiconductor chip, then heat radiation is improved, but the antenna formation is hindered
Solution Approach 1:
The patent transitions from planar heat radiation (2D surface mounting) to three-dimensional heat dissipation by forming thermal vias that extend vertically through the substrate layers. This allows heat to be conducted downward through the substrate thickness without occupying the surface area needed for the antenna, effectively moving the heat radiation function to a different spatial dimension.
Solution Approach 2:
The heat radiation function is segmented into multiple independent thermal vias distributed across the substrate, rather than using a single continuous heat-radiating member. This segmentation allows the antenna to be formed on the surface while heat is simultaneously conducted through multiple discrete via paths to external heat sinks or ground planes.
2Temperature
If a TIM is interposed between the semiconductor chip and the mother board, then heat radiation is improved, but the mountability is deteriorated due to thickness control requirements
Solution Approach 1:
The patent introduces thermal vias as an intermediary heat conduction path between the semiconductor chip and the external environment. These vias are formed as integrated structures within the substrate during PCB manufacturing, serving as a built-in thermal interface that eliminates the need for separate TIM layers and their associated thickness control requirements.
Solution Approach 2:
The substrate itself provides the heat radiation function through integrated thermal vias, eliminating the need for external TIM components. The substrate structure serves its own thermal management needs, reducing the number of separate components and assembly steps required.
3Temperature
If a TIM with reflow heat resistance is used, then heat radiation is improved, but the cost is increased
Solution Approach 1:
The patent replaces expensive, specialized reflow-resistant TIM materials with standard PCB substrate materials and conventional thermal vias that can be formed using existing PCB manufacturing processes. This substitution uses readily available, low-cost materials and techniques to achieve the same heat radiation function.
Solution Approach 2:
The heat radiation function is merged into the substrate structure itself through thermal vias, combining the mechanical support function and thermal management function into a single integrated component. This eliminates the need for separate TIM materials and their associated high costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for reliable heat radiation from the semiconductor chip to the substrate, improving mountability and reducing costs associated with thermal interface materials while maintaining efficient thermal conductivity.
Implementation Method 1
the second substrate is provided with a thermal via which radiates the heat in the electronic element
Implementation Method 2
a resin material disposed between the first substrate and the second substrate... containing inorganic fillers, such as aluminum nitride, to efficiently radiate heat
Data Source
AI summary
An electronic apparatus includes a semiconductor chip 15, a first substrate 10A having an antenna 12 formed on a first face 10a thereof and having the semiconductor chip 15 loaded on a second face 10b thereof, a second substrate 20A on which the first substrate 10A is provided so as to face the semiconductor chip 15, and which is connected to the outside, copper core solder balls 18 electrically connecting the first substrate 10A and the second substrate 20A, and a resin material 30 disposed between the first substrate 10A and the second substrate 20A. The second substrate 20A is provided with a thermal via 27 which radiates the heat in the semiconductor chip 15.