Thermal Via Surface Features for IC Substrate Stress Reduction
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Solution Overview
Problem
Conventional thermal via-bar structures in high power microelectronic packages are associated with package stress, leading to reduced device reliability and ineffective thermal energy dissipation.
Innovation Solution
The substrate incorporates thermal via structures with defined surface features that provide a robust thermal channel with low thermal resistance, enhancing mechanical stability and thermal transfer efficiency by using thermally-conductive materials and tailored surface features.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If via-bar structures are used to increase heat-conducting cross-sectional area, then thermal resistance is reduced, but package stress increases and device reliability decreases
Solution Approach 1:
The thermal via structure is divided into multiple segments: a via-bar portion for heat conduction and a separate reinforcement portion for mechanical support. This segmentation allows the thermal function to be optimized without compromising mechanical reliability, as the reinforcement portion compensates for stress concentration at the via-bar interfaces.
Solution Approach 2:
The thermal via structure employs composite construction by combining via-bar material (for thermal conductivity) with reinforcement material (for mechanical strength). This composite approach enables simultaneous optimization of thermal performance and structural reliability, resolving the contradiction between heat dissipation efficiency and device reliability.
2Loss of energy
If thermal via structures are enlarged to improve thermal channel capacity, then thermal energy dissipation improves, but mechanical stability deteriorates
Solution Approach 1:
The structure separates thermal conduction (via-bar) from mechanical support (reinforcement portion), allowing independent optimization. The via-bar can be enlarged for thermal dissipation while the reinforcement portion maintains mechanical stability through its geometric configuration and material properties.
Solution Approach 2:
Different portions of the thermal via structure have different functional qualities: the via-bar portion is optimized for thermal conductivity, while the reinforcement portion is optimized for mechanical strength. This local differentiation allows the structure to simultaneously achieve high thermal dissipation and mechanical stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves substrate reliability and thermal energy dissipation, allowing for increased thermal via structure dimensions and improved electrical characteristics, thereby enhancing the reliability and performance of high power microelectronic devices.
Implementation Method 1
thermal via structures with defined surface features... providing a robust thermal channel with low thermal resistance... using thermally-conductive materials
Data Source
AI summary
Embodiments of the present disclosure describe apparatuses, methods, and systems of thermal via structures with surface features. In some embodiments the surface features may have dimensions greater than approximately one micron. The thermal via structures may be incorporated into a substrate of an integrated circuit device. Other embodiments may be described and/or claimed.