Thermal Vias in IC Package with Embedded Die
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Solution Overview
Problem
Conventional thermal management in system-in-package technology faces challenges in efficiently removing heat from integrated circuit packages due to limitations in heat escape pathways through the die, underfill, and package substrate materials.
Innovation Solution
The implementation of thermal vias in the package substrate with a cross-sectional shape resembling the union of overlapping circles, coupled with copper plating on the die's thermal hotspots, provides an efficient thermal path to package contacts, enhancing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional thermal management with standard thermal vias is used, then heat can be removed from the die, but the thermal pathways are insufficient and heat dissipation efficiency is limited
Solution Approach 1:
The thermal via structure is segmented into multiple components: copper plating layers on the die surface, thermal via holes through the substrate, and thermal pads on the opposite side. This segmentation allows each component to optimize heat transfer in its specific zone, improving overall thermal management efficiency
Solution Approach 2:
Copper plating is applied locally at thermal hotspot areas on the die surface rather than uniformly across the entire die. This local quality approach concentrates thermal conduction capacity where heat generation is highest, maximizing heat dissipation efficiency while minimizing material usage and structural complexity
2Temperature
If thermal vias are concentrated at hotspots with copper plating, then heat transfer is enhanced, but manufacturing precision requirements increase
Solution Approach 1:
Copper plating is applied to the die surface before the die is mounted in the package substrate. This preliminary action allows the thermal hotspots to be identified and addressed during die preparation, enabling precise via placement at hotspot locations while maintaining standard manufacturing tolerances in subsequent assembly steps
Solution Approach 2:
The copper plating process itself serves dual purposes: it provides electrical connectivity and creates the thermal conduction pathway. The plating naturally follows the contour of the die surface and bonding pads, self-aligning the thermal via locations to optimal positions without requiring additional alignment steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution creates an effective thermal pathway for heat to escape from the die to package contacts, improving thermal management and reducing thermal stress by concentrating vias at hotspots and using conductive materials like copper for enhanced heat transfer.
Implementation Method 1
copper plating on the die's thermal hotspots, provides an efficient thermal path to package contacts, enhancing heat dissipation
Data Source
AI summary
In a multi-module integrated circuit package having a package substrate and package contacts, a die is embedded in the package substrate with thermal vias that couple hotspots on the embedded die to some of the package contacts.