Thermal Wall Layout for High-Density Data Center Heat Rejection

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Solution Overview

Problem

Current cooling solutions for data centers are limited by existing data center designs and footprints, which struggle to handle the higher density heat loads generated by artificial intelligence and high compute applications.

Innovation Solution

A thermal wall heat rejection system with stacked heat rejection units, featuring alternating coils and fans to create hot and cold aisles, reducing footprint and enhancing heat rejection density.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If traditional cooling solutions are used in existing data center designs, then the system is compatible with current footprints, but the heat rejection density is insufficient for AI and high compute applications

Engineering Contradiction:
Improveheat rejection densityVSAvoidfootprint
Core Design Contradiction:
ProductivityVSArea of stationary object

Solution Approach 1:

The patent transitions from horizontal placement of heat rejection units to vertical stacking, utilizing the vertical dimension to increase heat rejection density without expanding the horizontal footprint. Multiple heat rejection units are stacked vertically to create a compact configuration that handles higher heat loads within the same facility footprint.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The cooling system is divided into modular heat rejection units that can be individually stacked and configured. Each unit contains separate components (coils, fans, housings) that are segmented and arranged in specific patterns to optimize heat rejection while maintaining compact dimensions.

Inventive Principle:
Principle #1Segmentation

2Productivity

If heat rejection units are stacked vertically to increase density, then heat rejection capacity improves, but system complexity increases

Engineering Contradiction:
Improveheat rejection capacityVSAvoidsystem complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

Multiple heat rejection units are merged into a single vertical stack, combining their cooling capacities while sharing common structural support and control systems. The alternating arrangement of coils and fans within the stack creates an integrated system that achieves high heat rejection capacity without proportionally increasing complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The system incorporates variable speed fans and controllable coil configurations that can dynamically adjust operation based on heat load requirements. This dynamic control allows the complex stacked system to optimize performance while managing operational complexity through adaptive rather than static configurations.

Inventive Principle:
Principle #15Dynamics

3Productivity

If alternating coils and fans are arranged to create hot and cold aisles, then cooling efficiency improves, but manufacturing complexity increases

Engineering Contradiction:
Improvecooling efficiencyVSAvoidmanufacturing complexity
Core Design Contradiction:
ProductivityVSEase of manufacture

Solution Approach 1:

The heat rejection units are segmented into standardized modules with repeating patterns of coils and fans. This modular segmentation allows for simplified manufacturing of individual units that can then be assembled into the alternating hot/cold aisle configuration, reducing overall manufacturing complexity while maintaining cooling efficiency.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the stacked system have specialized configurations - with coils and fans arranged in alternating patterns to create localized hot and cold zones. This local quality arrangement optimizes cooling efficiency in specific areas while the overall modular structure maintains ease of manufacture through standardization.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system achieves high heat rejection density with reduced footprint, improving cooling efficiency and compatibility with existing data center designs.

Implementation Method 1

a first coil of the first heat rejection unit faces the second coil of the second heat rejection unit to define a cold inlet aisle

Methodology Applied
Scientific EffectHeat transfer: Heat Exchanger

Implementation Method 2

a first set of one or more first fans and a second heat rejection unit arranged proximate to the first heat rejection unit, where the second heat rejection unit includes a second set of one or more second fans

Methodology Applied
Scientific EffectForced convection: Forced Convection

Data Source

PatentUS20260006758A1Thermal wall heat rejection system
Publication Date: 2026.01.01 VERTIV CORP
  • US20260006758A1 patent drawing
  • US20260006758A1 patent drawing
  • US20260006758A1 patent drawing

AI summary

A thermal wall heat rejection system may include a first heat rejection unit including at least a first set of one or more first fans and a first coil. The system may further include a second heat rejection unit arranged proximate to the first heat rejection unit. The second heat rejection unit may further include a second set of one or more second fans and a second coil. The one or more first fans of the first heat rejection unit may face the one or more second fans of the second heat rejection unit to define a hot outlet aisle. The first coil of the first heat rejection unit may face the second coil of the second heat rejection unit to define a cold inlet aisle.