Thermal Wall Layout for High-Density Data Center Heat Rejection
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Solution Overview
Problem
Current cooling solutions for data centers are limited by existing data center designs and footprints, which struggle to handle the higher density heat loads from artificial intelligence and high compute applications, necessitating a more efficient thermal management system.
Innovation Solution
A thermal wall heat rejection system with stacked heat rejection units featuring alternating fan and coil configurations to create hot and cold aisles, reducing recirculation and footprint, and incorporating controllers for dynamic temperature adjustments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional cooling solutions are used in existing data center designs, then the system can maintain basic cooling function, but the heat rejection density is insufficient to handle AI and high compute applications
Solution Approach 1:
The patent transitions from horizontal placement to vertical stacking of heat rejection units, utilizing the vertical dimension to increase heat rejection density. The stacked configuration allows multiple units to be arranged vertically within the same footprint, effectively multiplying the cooling capacity without requiring additional horizontal space, thus resolving the contradiction between heat rejection density and adaptability to existing data center footprints.
Solution Approach 2:
The heat rejection system is divided into modular units that can be independently stacked and configured. Each unit contains discrete components (fans, coils, housings) that can be assembled in standardized configurations. This segmentation enables flexible deployment in existing data centers while achieving high heat rejection density through vertical stacking of multiple modular units.
2Area of stationary object
If heat rejection units are stacked vertically to increase density, then the footprint is reduced, but the structural weight and complexity increase
Solution Approach 1:
Multiple functional components (fans, coils, housings, mounting structures) are merged into integrated heat rejection units. The housing structures serve dual purposes as both protective enclosures and stacking interfaces, eliminating the need for separate structural support elements. This merging reduces overall system weight while enabling vertical stacking to minimize footprint.
Solution Approach 2:
The heat rejection units are designed with universal stacking interfaces and standardized configurations that serve multiple functions: structural support, thermal management, and mechanical assembly. The standardized design allows units to be stacked vertically for space efficiency while the multi-functional components reduce overall system weight by eliminating redundant structural elements.
3Loss of energy
If fans are positioned to face each other in stacked units, then hot air recirculation is reduced, but the device complexity increases
Solution Approach 1:
Instead of positioning fans to blow air in the same direction, the patent inverts the configuration by having fans in adjacent stacked units face each other. This inverted arrangement creates opposing airflow patterns that prevent hot air recirculation between units. The coils are similarly positioned to face each other, creating an alternating hot/cold aisle pattern that enhances thermal management efficiency.
Solution Approach 2:
The fan and coil configurations are optimized locally within each stacked unit to achieve specific airflow patterns. Each unit is designed with fans and coils positioned at specific locations and orientations to create controlled airflow paths that prevent hot air recirculation. This local optimization of component placement and orientation reduces energy loss from recirculation while maintaining manageable device complexity through standardized unit designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves high heat rejection density, reduces weight and footprint by approximately 40%, and maintains efficient cooling performance while accommodating increased heat loads.
Implementation Method 1
a first heat rejection unit including at least a first set of one or more first fans and a first coil
Implementation Method 2
a first heat rejection unit including at least a first set of one or more first fans and a first coil
Data Source
Figure 1A
Figure 1B
Figure 2
AI summary
A thermal wall heat rejection system may include a first heat rejection unit including at least a first set of one or more first fans and a first coil. The system may further include a second heat rejection unit arranged proximate to the first heat rejection unit. The second heat rejection unit may further include a second set of one or more second fans and a second coil. The one or more first fans of the first heat rejection unit may face the one or more second fans of the second heat rejection unit to define a hot outlet aisle. The first coil of the first heat rejection unit may face the second coil of the second heat rejection unit to define a cold inlet aisle.