Thermal Zone Monitoring Using Virtual Sensors
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Solution Overview
Problem
Portable electronic devices face challenges in managing thermal behavior, particularly in maintaining user comfort by regulating exterior surface temperatures while ensuring performance, due to limited sensor placement and cost constraints of discrete thermal sensors.
Innovation Solution
A closed-loop thermal control process that defines thermal zones on the device's exterior surface, using embedded sensors and thermal models to estimate representative temperatures, allowing for proactive measures to reduce heat generation and maintain user comfort without overly constraining performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If discrete thermal sensors (thermocouples, thermistors) are used to monitor critical points, then temperature measurement accuracy is improved, but device cost increases significantly
Solution Approach 1:
The patent uses on-die temperature sensors that are already present in the processor to create virtual temperature readings for critical points. Instead of placing discrete sensors at every critical location, the system copies the thermal information from easily accessible on-die sensors and uses thermal models to estimate temperatures at hard-to-reach points, thereby avoiding the high cost of discrete sensors while maintaining measurement accuracy
Solution Approach 2:
The patent introduces thermal models as intermediaries between the on-die temperature sensors and the critical points. These models act as mediators that translate sensor readings from accessible locations into accurate temperature estimates for inaccessible critical points, eliminating the need for expensive discrete sensors at each critical location
2Measurement precision
If temperature sensors are placed at critical points (e.g., bottom face of case, rear face of smartphone), then temperature monitoring accuracy at hotspots is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The system copies thermal data from on-die sensors that are already integrated into the processor, eliminating the need to physically place sensors at difficult-to-reach critical points. The thermal model copies the thermal behavior patterns from the on-die sensors to predict temperatures at external critical points
Solution Approach 2:
The patent replaces the mechanical approach of physically placing sensors at critical points with a computational approach using thermal models. Instead of mechanically installing sensors in difficult locations, the system uses mathematical models to calculate temperatures based on electrical/thermal data from on-die sensors, thereby reducing manufacturing complexity
3Reliability
If multiple discrete thermal sensors are embedded throughout the device, then thermal monitoring coverage is improved, but manufacturing cost and device complexity increase
Solution Approach 1:
The patent makes the on-die temperature sensors serve multiple functions: they not only monitor processor temperature but also provide data for estimating temperatures at multiple external critical points through thermal models. This multi-functionality eliminates the need for separate discrete sensors at each critical location, reducing overall sensor count while maintaining comprehensive thermal coverage
Solution Approach 2:
The system merges the functions of multiple discrete sensors into a single on-die temperature sensor combined with thermal modeling. Instead of having separate sensors at each critical point, the on-die sensor data is combined with thermal models to simultaneously monitor temperatures across multiple critical locations, reducing component count and simplifying manufacturing
4Ease of operation
If proactive thermal measures are taken to maintain user comfort, then user satisfaction is improved, but device performance may be constrained
Solution Approach 1:
The system takes preliminary action by continuously monitoring thermal conditions and predicting future temperature trends using thermal models. By detecting potential overheating conditions before they occur, the system can proactively adjust performance or activate cooling measures, preventing performance throttling while maintaining user comfort
Solution Approach 2:
The patent implements a feedback mechanism where thermal model predictions are continuously compared against temperature thresholds, and the system dynamically adjusts performance or cooling based on predicted thermal conditions. This real-time feedback allows the system to maintain optimal performance while ensuring user comfort by acting on predicted rather than just current thermal states
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively manages thermal behavior, maintaining high device performance while ensuring user comfort by automatically adjusting power consumption and cooling mechanisms based on estimated zone temperatures, thus addressing the limitations of traditional sensor placement and cost issues.
Implementation Method 1
Temperature sensors may be embedded or integrated inside the housing of the product, to sense temperature at various locations
Implementation Method 2
Thermal models may be generated to accurately estimate the 'virtual temperature' at these critical points, based on data received from temperature sensors located elsewhere in the device
Data Source
AI summary
A predefined mathematical relationship that is stored in the memory of a computing system is accessed, wherein the relationship refers to temperatures of a number of points in the system, wherein the points together define a zone. The mathematical relationship yields a representative temperature for the zone. Temperature data from sensors in the system is obtained and applied to thermal models, to estimate the temperatures of at least some of the points that define the zone. The representative temperature for the zone is computed using the estimated temperatures as input to the mathematical relationship. A decision is then made on whether or not to change a power consuming activity limit in the system, based on the computed representative temperature. Other embodiments are also described and claimed.