Motherboard Thermal Zoning for Peripheral Circuit Overclocking Control
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Solution Overview
Problem
During extreme overclocking of CPU, GPU, or memory modules, the peripheral circuit elements on a motherboard are either not cooled optimally or cooled too much, leading to inefficient operation of the overclocking target elements due to suboptimal working temperatures.
Innovation Solution
A temperature adjustment module comprising a temperature changing module and a temperature control module, where the temperature changing module is in contact with peripheral circuit elements through a heat conduction material and includes a printed circuit board with winding wires or temperature-variable electronic components to adjust temperatures, and the temperature control module electrically connected to achieve target temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If liquid nitrogen or liquid helium is used to cool down the overclocking target element, then the frequency of the overclocking target element may be increased to an extremely high frequency, but the peripheral circuit element on the mother board may be simultaneously cooled down to an insufficient or excessive degree, resulting in inability to operate efficiently
Solution Approach 1:
The cooling system is divided into separate zones: a first cooling area for the overclocking target element (CPU/GPU/memory) and a second cooling area for the peripheral circuit elements. This segmentation allows independent temperature control for each zone, enabling the main element to be cooled to extremely low temperatures for high-frequency operation while peripheral elements are maintained at appropriate operating temperatures through selective heating or reduced cooling.
Solution Approach 2:
Different thermal treatment strategies are applied to different spatial locations on the motherboard. The overclocking target element receives intensive cooling with liquid nitrogen or helium to achieve extremely low temperatures, while peripheral circuit elements receive controlled heating or limited cooling to maintain their optimal operating temperature ranges, creating locally optimized thermal conditions for each component type.
2Productivity
If the peripheral circuit element is cooled down to an extremely low temperature, then the overclocking target element can operate at high frequency, but the operating efficiency of the overclocking target element cannot work normally due to the peripheral circuit element
Solution Approach 1:
A temperature control module acts as an intermediary between the cooling system and the peripheral circuit elements. This intermediary component actively manages heat transfer to peripheral elements, preventing excessive cooling by introducing compensating heat or controlling the cooling fluid flow, thereby ensuring peripheral elements maintain reliable operation while the main overclocking element achieves high-frequency performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures peripheral circuit elements operate at optimal temperatures, maintaining high efficiency of main circuit elements during overclocking by adjusting temperatures to prevent overheating or undercooling, thereby enhancing overall system performance.
Implementation Method 1
The temperature changing module is in contact with a peripheral circuit element on a mother board through the temperature changing area and a heat conduction material
Implementation Method 2
The temperature of the temperature changing module is changed by at least one of a winding wire or an electronic component on the printed circuit board
Data Source
Figure 1~2
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AI summary
A temperature adjustment module (100, 200) is provided. The temperature adjustment module (100, 200) includes a temperature changing module (120, 220, 320-340, 520, 620, 720, 820, 920, 1021-1024, 1121-1124) and a temperature control module (110, 210, 510, 610, 1011, 1012, 1111, 1112). The temperature changing module (120, 220, 320-340, 520, 620, 720, 820, 920, 1021-1024, 1121-1124) includes a temperature changing area (701-709, 801-804, 901-904). The temperature changing module (120, 220, 320-340, 520, 620, 720, 820, 920, 1021-1024, 1121-1124) is in contact with a peripheral circuit element (302-304, 501, 601) on a motherboard through the temperature changing area (701-709, 801-804, 901-904) and a heat conduction material (502, 602). The temperature control module (110, 210, 510, 610, 1011, 1012, 1111, 1112) is electrically connected to the temperature changing module (120, 220, 320-340, 520, 620, 720, 820, 920, 1021-1024, 1121-1124) and configured to control a temperature of the temperature changing module (120, 220, 320-340, 520, 620, 720, 820, 920, 1021-1024, 1121-1124) to reach a target temperature. The temperature changing module (120, 220, 320-340, 520, 620, 720, 820, 920, 1021-1024, 1121-1124) further includes a printed circuit board in the temperature changing area (701-709, 801-804, 901-904), and the temperature of the temperature changing module (120, 220, 320-340, 520, 620, 720, 820, 920, 1021-1024, 1121-1124) is changed by at least one of a winding wire or an electronic component on the printed circuit board.