Thermally Actuated Coolant Flow Control for Heat Exchangers
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Solution Overview
Problem
Conventional heat sink and heat exchange technologies lack the ability to actively control or adjust their cooling profiles, making it difficult to maintain multiple electronic devices at the same temperature or selectively offset temperatures of different device types in high-performance computing systems.
Innovation Solution
A coolant flow control apparatus with thermally actuated valves, such as bimetallic or shape memory alloy-based devices, is positioned along the coolant flow paths of liquid flow through heat exchangers to automatically regulate coolant flow based on temperature changes, ensuring dynamic adjustment of cooling according to the thermal energy dissipation of adjacent electronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional static heat exchanger design is used, then device complexity is reduced, but the ability to actively control cooling profiles is lost
Solution Approach 1:
The heat exchanger system performs self-diagnosis and self-regulation through the controller, which monitors temperature sensors and automatically adjusts coolant flow valves without external intervention. The controller executes control algorithms to maintain optimal thermal conditions, enabling the system to serve itself in monitoring and adjustment functions.
Solution Approach 2:
The system transitions from static coolant flow control to dynamic control by implementing adjustable coolant flow valves that can modify flow rates in real-time based on thermal conditions. The controller continuously adapts valve positions according to temperature sensor feedback, allowing the heat exchanger to dynamically respond to changing thermal loads and maintain optimal cooling performance.
2Area of stationary object
If multiple electronic devices with different cooling requirements are located on the same PCB assembly, then space utilization is improved, but temperature uniformity deteriorates
Solution Approach 1:
The system implements independent temperature control for different regions by placing temperature sensors and coolant flow valves at specific locations corresponding to different electronic devices or device groups. The controller adjusts coolant flow distribution to provide localized cooling tailored to the thermal requirements of each device, enabling high-power devices to receive more cooling while low-power devices receive appropriate minimal cooling.
Solution Approach 2:
The system changes the coolant flow rate parameter dynamically for different heat exchanger channels based on detected thermal conditions. By adjusting flow rates independently in different channels, the system can provide customized cooling intensity to different device types (processors, memories, voltage regulator modules) to achieve selective temperature offset or uniform temperature distribution as required.
3Measurement precision
If active control capability is added to heat exchangers, then temperature control precision is improved, but device complexity increases
Solution Approach 1:
The system implements closed-loop feedback control by continuously monitoring temperatures through sensors and using this information to adjust coolant flow valve positions. The controller receives temperature feedback, compares it with target temperature setpoints, and automatically modifies coolant flow rates to eliminate temperature deviations, achieving precise temperature control through continuous feedback-adjustment cycles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for dynamic configuration of coolant flow to direct more cooling to regions with higher thermal energy dissipation, maintaining optimal temperatures without external logic, ensuring efficient cooling performance and preventing overheating.
Implementation Method 1
A flow control device, such as a thermally actuated valve, bimetallic or shape memory alloy-based device, is positioned along the coolant flow path
Implementation Method 2
A flow control device, such as a thermally actuated valve, bimetallic or shape memory alloy-based device, is positioned along the coolant flow path
Implementation Method 3
liquid flow through (LFT) heat sink and heat exchange technologies
Implementation Method 4
liquid flow through (LFT) heat sink and heat exchange technologies
Data Source
AI summary
In association with a liquid flow through a heat exchanger situated to remove heat from electronic devices, a coolant flow control apparatus is provided. The coolant flow control apparatus comprises a first input channel for carrying liquid coolant to a first input of the heat exchanger; a flow control device positioned along a flow path that includes the first input channel, the flow control device, in response to a temperature of coolant proximate to the flow control device, is operable to enable or to prevent coolant flow along the first input channel into the heat exchanger; a second input channel for continuously carrying liquid coolant to a second input of the heat exchanger, during both times when the flow control device is enabling and is preventing the coolant flow along the first input channel into the heat exchanger; and an output channel for carrying coolant away from the heat exchanger.