Thermally Aware Boot Sequence for Portable Computing Devices

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Solution Overview

Problem

Portable computing devices (PCDs) face challenges in managing thermal energy, as they often lack active cooling mechanisms, leading to potential component damage and user experience issues during extreme use cases, necessitating a method to safely boot under varying thermal conditions.

Innovation Solution

A thermally aware boot mode that utilizes a low power processing component to delay or modify the boot sequence based on thermal measurements, comparing them to predetermined thresholds to ensure safe operation and optimize performance without jeopardizing component health.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If high power consumption processing components are brought online during boot sequence, then processing performance is improved, but thermal energy generation increases and may jeopardize component health

Engineering Contradiction:
Improveprocessing performanceVSAvoidthermal energy generation
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent applies preliminary action by having the low power consumption processing component evaluate thermal conditions and determine boot sequence modifications before high power consumption components are brought online. This allows the system to assess thermal safety and adjust the boot sequence accordingly, preventing thermal damage while still enabling high performance when conditions permit.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent changes the parameter of processing component power states during boot by selectively bringing components online at different power levels based on thermal conditions. The low power consumption processing component controls the power states of high power consumption components, adjusting them from offline to various operational states based on real-time thermal assessment.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If thermal mitigation techniques are implemented, then component health is protected, but processing performance is reduced

Engineering Contradiction:
Improvecomponent healthVSAvoidprocessing performance
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent applies dynamics by making the boot sequence adaptive rather than static. The low power consumption processing component dynamically evaluates thermal conditions and adjusts the boot sequence in real-time, allowing the system to optimize between component protection and performance based on current thermal states rather than applying fixed mitigation techniques.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system performs self-service by having the low power consumption processing component autonomously assess thermal conditions and make decisions about the boot sequence without external intervention. This self-evaluation and self-adjustment mechanism allows the system to protect itself from thermal damage while maximizing performance.

Inventive Principle:
Principle #25Self-service

3Reliability

If a complete reboot is performed under critical thermal conditions, then component health is protected from thermal runaway, but user experience is degraded and service is interrupted

Engineering Contradiction:
Improvecomponent healthVSAvoidservice interruption
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent applies partial action by performing selective modifications to the boot sequence rather than a complete reboot. The low power consumption processing component identifies specific components that need to be delayed or modified based on thermal conditions, allowing essential services to continue while protecting vulnerable components, thus avoiding full service interruption.

Inventive Principle:
Principle #16Partial or excessive action

4Reliability

If thermal mitigation software runs on main processors, then thermal energy generation is managed effectively, but the software cannot execute if processors are not online during boot

Engineering Contradiction:
Improvethermal energy managementVSAvoidsoftware execution capability
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The patent applies segmentation by separating the thermal management function into a distinct low power consumption processing component that operates independently during boot. This segmentation allows thermal evaluation and boot sequence control to occur before the main processors are online, solving the chicken-and-egg problem of needing processors to run thermal software while avoiding processor overheating.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentEP3570162B1System and method for thermally aware device booting
Publication Date: 2020.11.25 QUALCOMM INC
  • EP3570162B1 patent drawingFigure 1
  • EP3570162B1 patent drawingFigure 2
  • EP3570162B1 patent drawingFigure 3A

AI summary

Various embodiments of methods and systems for thermally aware booting in a portable computing device (PCD) are disclosed. Because bringing high power consumption processing components online when a PCD is booted under less than ideal thermal conditions can be detrimental to the health of the PCD, embodiments leverage a low power processing component early in a boot sequence to authorize, delay or modify the boot sequence based on measured thermal indicators. One exemplary method is essentially a go/no go method that delays or authorizes completion of a boot sequence based on the thermal indicator measurements. Another exemplary method modifies a boot sequence of a PCD based on a thermal boot policy associated with a thermal boot state. A thermal boot policy may include allowing the boot sequence to complete by modifying the power frequency to which one or more high power consumption components will be booted.