Thermally Conductive Adhesive Composition for Semiconductor Die-Bonding
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Solution Overview
Problem
Current thermally and electrically conductive adhesives for die-bonding semiconductor devices face challenges in achieving a balance between high heat dissipation performance, stable electric conductivity, and adhesion force, particularly due to limitations in thermal conductivity and adhesion strength caused by high content of expensive gold or hazardous lead in traditional solders.
Innovation Solution
A thermally and electrically conductive adhesive composition comprising submicron fine silver powder as the electrically conductive filler, a blend of bisphenol-type and novolac-type epoxy resins, and diaminodiphenyl sulfone or its derivatives as the curing agent, with a specific mass ratio and molar equivalent content, which promotes improved dispersity and sintering of silver particles for enhanced thermal and electrical conductivity while maintaining adhesion strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If high-temperature lead solder or gold-tin solder is used to achieve high heat-dissipation performance, then thermal conductivity is improved, but the material becomes hazardous to humans or increases cost
Solution Approach 1:
The patent replaces expensive and hazardous materials (lead solder, gold-tin solder) with a cost-effective alternative composition using silver powder, epoxy resin, and curing agent. This substitution eliminates the harmful effects of lead while maintaining thermal conductivity through the silver-filled adhesive composition, achieving both safety and performance requirements
Solution Approach 2:
The patent employs a composite material system consisting of silver powder particles dispersed in an epoxy resin matrix with curing agent. This composite structure combines the high thermal conductivity of silver with the adhesive properties and thermal stability of epoxy resin, achieving heat dissipation performance comparable to traditional solders without the associated hazards or costs
2Temperature
If high-temperature lead solder or gold-tin solder is used to achieve high heat-dissipation performance, then thermal conductivity is improved, but the cost increases
Solution Approach 1:
The patent substitutes expensive gold-tin solder with a more economical formulation using silver powder and epoxy resin. This replacement significantly reduces material costs while maintaining the necessary thermal conductivity for heat dissipation applications, making the solution economically viable for widespread use
3Ease of manufacture
If electrically conductive adhesive is used to replace solder, then cost is reduced and lead-free technology is achieved, but thermal conductivity and adhesion force are insufficient
Solution Approach 1:
The patent optimizes the physical and chemical parameters of the adhesive composition, specifically controlling the particle size distribution, shape, and content of silver powder within 70-95 mass%. It also adjusts the epoxy resin to curing agent ratio and incorporates specific additives to enhance thermal conductivity and adhesion force, transforming a conventional low-performance adhesive into a high-performance thermal interface material
Solution Approach 2:
The patent creates a specialized composite material where silver powder serves as both the conductive filler and thermal management component, embedded in a tailored epoxy resin system. This composite structure provides simultaneous electrical conductivity, thermal conductivity, and strong adhesion, overcoming the limitations of conventional electrically conductive adhesives
4Reliability
If electrically conductive adhesive contains high content of metal particles to improve conductivity, then electrical conductivity is improved, but adhesion force decreases
Solution Approach 1:
The patent precisely controls the metal particle content within 70-95 mass% of the total composition, optimizing the balance between conductivity and adhesion. It also adjusts the epoxy resin to curing agent ratio and incorporates surface-treated silver particles with controlled morphology, maintaining sufficient adhesive strength while achieving the required electrical conductivity for semiconductor bonding applications
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition demonstrates high heat dissipation performance, stable electrical conductivity, and strong adhesion force, effectively addressing the limitations of traditional solders by optimizing the content and type of epoxy resins and curing agents to enhance silver particle dispersity and sintering.
Implementation Method 1
an electrically conductive adhesive is a composite material of a metal particle having functions such as electrical conductivity (for example, silver, nickel, copper, aluminum, or gold) and an organic adhesive having an adhesive function
Implementation Method 2
The electrically conductive filler (A) is a submicron fine silver powder, and the content of the fine silver powder is 75 to 94% by mass relative to the total amount of the thermally and electrically conductive adhesive composition
Implementation Method 3
The adhesive composition demonstrates high heat dissipation performance, stable electrical conductivity, and strong adhesion force
Data Source
AI summary
[Problem] Provided is a thermally and electrically conductive adhesive composition used as a die-bonding material which shows high heat dissipation performance and stable electric conductivity as well as high adhesion force. [Solution] Provided is a thermally and electrically conductive adhesive composition, comprising: (A) an electrically conductive filler; (B) an epoxy resin; (C) a curing agent, and (D) an organic solvent, in which the electrically conductive filler (A) is a submicron fine silver powder, and the content of the electrically conductive filler (A) is such that (A) / (B) is 96.0 / 4.0 to 99.5 /0.5 in the mass ratio to the content of the epoxy resin (B); and the epoxy resin (B) comprises at least a bisphenol-type epoxy resin and a novo lac-type epoxy resin; and the curing agent (C) is diaminodiphenyl sulfone and/or a derivative thereof, and the content of the curing agent (C) is 0.4 to 2.4 molar equivalents in terms of equivalent of active hydrogen relative to 1 molar equivalent of epoxy groups in the epoxy resin (B).