Thermally Conductive Coating Composition for Battery Thermal Management
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Solution Overview
Problem
Current coating compositions, including sealants and adhesives, lack effective thermal conductivity and mechanical properties, particularly in applications requiring high thermal management and durability, such as in battery packs and circuit boards.
Innovation Solution
A composition comprising a thiol-terminated compound, an oxidant, and thermally conductive, electrically insulative filler particles with a thermal conductivity of at least 5 W/m·K and volume resistivity of at least 1 Ω·m, which provides enhanced thermal conductivity, mechanical strength, and electrical insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional coating compositions are used, then ease of manufacture is maintained, but thermal conductivity is insufficient
Solution Approach 1:
The patent employs composite materials by combining thermally conductive filler particles (such as aluminum oxide, aluminum nitride, or boron nitride) with a polymer matrix (epoxy, polyester, or polyurethane). This composite structure enables the coating to achieve high thermal conductivity (at least 0.4 W/m·K) while maintaining ease of manufacture through conventional coating application methods.
2Temperature
If thermally conductive fillers are added to improve thermal conductivity, then thermal management capability is enhanced, but electrical insulation may be compromised
Solution Approach 1:
The patent applies local quality by selecting filler particles with specific local properties: high thermal conductivity combined with high electrical resistivity. Materials like aluminum oxide, aluminum nitride, and boron nitride are chosen because they possess the dual characteristic of being thermally conductive while electrically insulative, thus achieving thermal management without compromising electrical insulation reliability.
Solution Approach 2:
The composite material system combines thermally conductive yet electrically insulative filler particles with a polymer matrix that provides additional electrical insulation. This composite approach ensures both thermal conductivity (at least 0.4 W/m·K) and electrical insulation (dielectric strength of at least 1 kV/mm) are achieved simultaneously.
3Temperature
If high filler content is used to maximize thermal conductivity, then thermal management performance improves, but mechanical properties and durability may deteriorate
Solution Approach 1:
The patent applies parameter changes by optimizing the filler content within a specific range (at least 50% by volume of the filler package, but balanced with matrix content) and selecting appropriate particle size distributions. This optimization ensures sufficient thermal conductivity while maintaining mechanical integrity, as evidenced by achieved properties including tensile strength of 1-100 MPa and elongation of 1-900%.
Solution Approach 2:
The composite material formulation balances filler content with polymer matrix content to achieve both high thermal conductivity and excellent mechanical properties. The polymer matrix (epoxy, polyester, or polyurethane) provides structural integrity, adhesion, and flexibility, while the thermally conductive fillers provide heat dissipation. This balanced composite structure achieves thermal conductivity of at least 0.4 W/m·K while maintaining tensile strength of 1-100 MPa and elongation of 1-900%.
4Temperature
If conventional sealants and adhesives are used, then ease of operation is maintained, but thermal management and mechanical durability are insufficient
Solution Approach 1:
The patent applies universality by creating a multi-functional coating composition that simultaneously provides thermal conductivity, electrical insulation, mechanical strength, adhesion, and flexibility. The composition can be applied using conventional coating methods (brush, roll, spray) and cures to form a coating that meets multiple performance requirements, including thermal conductivity of at least 0.4 W/m·K, dielectric strength of at least 1 kV/mm, and 180° peel strength of at least 1 lbf/in.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves thermal conductivity of at least 0.4 W/m·K, dielectric strength of 1 kV/mm, shore A hardness of 5 to 95, 180° peel strength of at least 1 lbf/in, tensile stress at break of 1 MPa to 100 MPa, and elongation of 1% to 900%, making it suitable for thermal management and mechanical durability in various applications.
Implementation Method 1
A composition comprising a thiol-terminated compound, an oxidant, and thermally conductive, electrically insulative filler particles
Implementation Method 2
thermally conductive, electrically insulative filler particles having a thermal conductivity of at least 5 W/m·K
Data Source
AI summary
Disclosed herein is a composition comprising a thiol-terminated compound; an oxidant; and a thermally conductive filler package comprising thermally conductive, electrically insulative filler particles. The thermally conductive, electrically insulative filler particles have a thermal conductivity of at least 5 W/m·K (measured according to ASTM D7984) and a volume resistivity of at least 1 Ω·m (measured according to ASTM D257, C611, or B193) and may be present in an amount of at least 50% by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of 15% by volume percent to 90% by volume based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a composition disclosed herein.

