Thermally Conductive Composition for Peelable Electronic Cooling
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Solution Overview
Problem
Thermally conductive materials used in electronics often fail to fully contact device surfaces due to surface irregularities, leading to inefficient heat transfer, and when they do contact, they either stick permanently or migrate, making repair and recycling difficult, with few materials capable of being peeled off without residue.
Innovation Solution
A thermally conductive composition comprising polyorganosiloxane with unsaturated organic groups, organopolysiloxane, thermally conductive filler, organohydrogenpolysiloxane, and a hydrosilylation catalyst, which can be applied and cured on electronic devices to form a material that fully contacts the surface without sticking and can be easily peeled off, utilizing a compound with specific unsaturated organic groups and a reinforcing filler.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermally conductive silicone rubbers or elastomers are cured before application, then they have cohesive strength to prevent migration, but they cannot fully contact irregular surfaces due to air spaces
Solution Approach 1:
The patent changes the curing parameter from pre-application curing to post-application curing. The composition remains uncured during application, allowing it to conform to surface irregularities, then cures after application to provide cohesive strength. This resolves the contradiction by sequencing the parameter change (curing state) appropriately in the process.
Solution Approach 2:
The patent introduces a dynamic state change in the material: from uncured (fluid-like, adaptable) state during application to cured (solid-like, structurally sound) state after application. This dynamic transition allows the material to adapt to surface irregularities first, then gain structural integrity, resolving the contradiction between adaptability and strength.
2Manufacturing precision
If thermally conductive adhesives are used, then full surface contact is achieved, but the devices cannot be peeled off for repair or recycling
Solution Approach 1:
The patent uses a dynamic curing process where the material transitions from uncured (peelable) to cured (strong bonding) state. During application and positioning, the material remains uncured and can be removed if needed. After proper positioning, curing provides strong adhesion. This temporal separation of peelability and bonding strength resolves the contradiction.
Solution Approach 2:
The patent applies the material in an uncured state before final positioning, allowing for adjustment and removal if necessary. The curing process is initiated after the material is properly positioned, ensuring that full surface contact is achieved while maintaining ease of repair during the application phase.
3Ease of repair
If thermally conductive greases are used, then devices can be separated, but the greases migrate out during temperature cycling and are difficult to remove
Solution Approach 1:
The patent changes the physical state parameter from grease (prone to migration) to cured polymer (structurally stable). The uncured composition maintains grease-like applicability without migration, and curing transforms it into a stable, non-migrating state that provides both separability and substance retention.
Solution Approach 2:
The patent creates different properties in different phases: the uncured state provides grease-like workability and non-migration, while the cured state provides structural stability and controlled adhesion. This local quality differentiation resolves the contradiction between separability and substance retention.
4Reliability
If existing thermally conductive gels are cured, then migration is prevented, but they cannot be peeled off from electronic devices without remaining on the surface
Solution Approach 1:
The patent optimizes the curing parameter (time, temperature, catalyst) to achieve partial or controlled curing that provides migration prevention while maintaining peelability. The composition cures enough to prevent migration but not so much that it becomes permanently bonded, creating an optimal balance point in the curing parameter space.
Solution Approach 2:
The patent applies partial curing action - enough curing to prevent migration but not complete curing that would prevent peeling. This partial action approach resolves the contradiction by achieving the minimum necessary curing effect without over-curing that would eliminate peelability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition ensures efficient thermal conductivity by eliminating air gaps and allows for easy removal without residue, enhancing device performance and recyclability while maintaining thermal efficiency.
Implementation Method 1
a catalyst of hydrosilylation reaction
Data Source
AI summary
Provided are a composition, a cured polymer material formed from said composition, a method for forming a thermally conductive material on an article and an article having a thermally conductive material. Said thermally conductive material can be formed on an electronic device, and can be peeled off from said electronic device.