Thermally Conductive Core Circuit Module for High-Density Memory
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Solution Overview
Problem
Conventional DIMM-based memory expansion systems face limitations in density and thermal management as die sizes increase and bus speeds rise, leading to reduced device addressing and thermal issues with increased circuitry.
Innovation Solution
A high-density circuit module design featuring a thermally conductive rigid core substrate with secondary substrates populated with ICs, connected via a conductive member, providing a modular structure that surpasses traditional DIMMs in thermal efficiency and capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional DIMM-based solutions are used to provide memory expansion, then the system can accommodate memory devices, but the surface area available is limited and thermal management becomes problematic as die sizes increase
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement of devices on a conventional DIMM to a three-dimensional structure using vertical stacks. Multiple substrates are stacked vertically with interconnectors providing electrical connections between layers, enabling significantly higher device density without increasing the footprint area.
Solution Approach 2:
The patent implements a nested structure where multiple substrates containing ICs are stacked within a compact volume. Each substrate layer is nested within the overall module structure, with interconnectors penetrating through the stack to provide electrical pathways, effectively packing more functional units into a smaller space.
2Quantity of substance
If more devices are populated on a DIMM to increase capacity, then memory expansion capability improves, but thermal issues become more prominent
Solution Approach 1:
The patent introduces a thermally conductive core substrate as an intermediary element that serves dual purposes: providing mechanical support for the stacked substrates and acting as a heat sink to conduct thermal energy away from the densely packed ICs. This intermediary structure enables high device density while maintaining acceptable thermal characteristics.
3Speed
If bus speeds are increased to improve performance, then data transfer rate improves, but the number of devices per channel that can be reliably addressed decreases
Solution Approach 1:
The patent segments the addressing function by introducing buffer devices on intermediate substrates between the memory controller and the stacked memory devices. These buffers divide the long point-to-point addressing path into shorter segments, reducing signal degradation and enabling reliable operation at higher bus speeds with more devices per channel.
4Temperature
If a thermally conductive core substrate is used to improve thermal performance, then thermal management improves, but the structural complexity increases compared to traditional FR4 cored modules
Solution Approach 1:
The patent makes the core substrate multi-functional by designing it to simultaneously serve as a structural support element, a thermal management component through its thermally conductive properties, and an electrical interconnection platform. This consolidation of multiple functions into a single component achieves thermal performance improvement without proportionally increasing overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances memory expansion capacity and thermal performance by allowing more devices per channel and improved thermal management, addressing the limitations of conventional DIMM systems.
Implementation Method 1
the structural member is comprised of thermally conductive material
Data Source
AI summary
A circuit module is provided in which at least one secondary substrate and preferably two such secondary substrates are populated with integrated circuits (ICs). A rigid core substrate for the circuit module is comprised of a structural member and a connective member. In a preferred embodiment, the structural member is comprised of thermally conductive material while the connective member is comprised of conventional PWB material. The secondary substrate(s) are connected to the connective member with a variety of techniques and materials while, in a preferred embodiment, the connective member exhibits, in a preferred embodiment, traditional module contacts which provide an edge connector capability to allow the module to supplant traditional DIMMs.