Thermally Conductive Layers for Display Dead Area Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing display apparatuses face challenges in minimizing the dead area where no image is displayed, particularly due to heat damage during the manufacturing process, which affects the efficiency and reliability of the display units.
Innovation Solution
The display apparatus incorporates a first and second thermally conductive layer, connected to the power supply line and extending towards the edge of the substrate, to effectively dissipate heat generated during the curing process, thereby reducing the dead area and preventing damage to the driving circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the power supply line is located close to the seal to minimize dead area, then the area efficiency is improved, but heat damage to the driving circuit occurs during the curing process
Solution Approach 1:
A heat-resistant layer is introduced as an intermediary component between the power supply line and the driving circuit. This layer acts as a thermal barrier that protects the driving circuit from heat generated during the curing process, allowing the power supply line to be positioned close to the seal without causing heat damage to the driving circuit.
Solution Approach 2:
The heat-resistant layer is designed as a sacrificial or temporary protective element that absorbs or blocks heat during the curing process. This layer can be removed or degrades after serving its protective function, enabling the power supply line to be positioned optimally without compromising circuit reliability.
2Device complexity
If the power supply line is positioned to overlap the seal, then the manufacturing complexity is reduced, but heat damage during curing affects the display unit
Solution Approach 1:
The heat-resistant layer serves as a protective intermediary that enables the simplified overlapping structure to be implemented without compromising display unit quality. It absorbs or blocks harmful heat during curing, allowing the power supply line to overlap the seal for manufacturing simplicity while protecting the display unit from heat damage.
3Productivity
If the dead area is minimized by repositioning components, then the productivity is improved, but heat dissipation becomes insufficient
Solution Approach 1:
The heat-resistant layer acts as a thermal mediator that allows compact component arrangement for improved productivity while managing heat flow. It creates a thermal barrier that protects heat-sensitive components, enabling the power supply line to be positioned optimally for area efficiency without compromising heat dissipation capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation, reduces the dead area, and minimizes damage to the driving circuits, improving the overall efficiency and reliability of the display apparatus.
Implementation Method 1
a first thermally conductive layer located between the power supply line and the lower substrate such that at least a part of the first thermally conductive layer overlaps an end portion of the power supply line
Implementation Method 2
a second thermally conductive layer connected to the power supply line and located between the power supply line and the lower substrate such that at least a part of the second thermally conductive layer and another end portion of the power supply line overlap each other
Data Source
AI summary
A display apparatus includes a lower substrate including a peripheral area around a display area, an upper substrate facing the lower substrate, a display unit in the display area including a pixel circuit and a display device electrically connected to the pixel circuit, a seal in the peripheral area to surround the display unit, the seal adhering the lower substrate to the upper substrate, a power supply line between the lower substrate and the seal such that at least a portion of the power supply line and the seal overlap each other, and a first thermally conductive layer between the power supply line and the lower substrate, at least a part of the first thermally conductive layer overlapping an end portion of the power supply line, the first thermally conductive layer being connected to the power supply line and extending toward an edge of the lower substrate.