Thermally Conductive Element With Multilayer Coating
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Solution Overview
Problem
Current thermal management systems for electronic devices, such as high-powered components and optoelectronic devices like LEDs, face limitations due to insufficient thermal conductivity in standard laminate boards and separate thermal and electrical subsystems, which hinder effective heat dissipation and increase device operating temperatures.
Innovation Solution
A thermally and electrically conductive apparatus is developed, featuring a thermally conductive element in thermal contact with electronic devices, integrated with a multilayer coating system of alternating electrically insulating and conductive layers to provide both thermal conductivity and electrical pathways, allowing for direct mounting of electronic devices and enhanced heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If standard laminate boards are used for mounting high-powered electronic components, then the board structure is simple and easy to manufacture, but the thermal conductivity is insufficient to remove heat effectively
Solution Approach 1:
The patent employs a composite structure consisting of a thermally conductive substrate (such as aluminum or copper) combined with a dielectric layer having high thermal conductivity. This composite material approach allows the board to maintain structural integrity and ease of manufacture while achieving superior thermal conductivity to effectively remove heat from high-powered components.
2Temperature
If secondary cooling systems such as heatsinks or coldplates are added to laminate boards, then thermal management is improved, but the overall device complexity increases
Solution Approach 1:
The patent integrates the cooling function directly into the PCB structure by incorporating a thermally conductive substrate and high thermal conductivity dielectric layers within the board itself. This merging of thermal management functionality into the existing PCB architecture eliminates the need for separate secondary cooling systems, thereby improving heat dissipation while reducing overall device complexity.
3Strength
If the thickness of laminate board is increased to provide structural support, then mechanical strength is improved, but thermal conductivity is reduced due to the thickness barrier
Solution Approach 1:
The patent utilizes composite materials where the dielectric layer is specifically selected to have high thermal conductivity. This allows the board to achieve the necessary mechanical strength through the substrate and structural design while the high thermal conductivity dielectric layer ensures that even with increased thickness for structural support, thermal conductivity remains sufficient for effective heat removal.
4Temperature
If thermal vias with thermally conductive materials are incorporated into PCBs, then thermal flow between heat source and cooling system is enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent combines the thermal conduction function with the existing PCB manufacturing process by incorporating thermally conductive materials into the dielectric layers and utilizing the standard via structure. This integration allows thermal vias to be manufactured using conventional PCB techniques, enhancing thermal flow efficiency without significantly increasing manufacturing complexity.
5Temperature
If heat pipes or thermosyphons are used to remove heat from high-power components, then heat removal efficiency is improved, but the device complexity and space requirements increase
Solution Approach 1:
The patent merges the heat removal function directly into the PCB structure by using a thermally conductive substrate and high thermal conductivity dielectric layers to create an integrated thermal management system. This approach achieves heat removal efficiency comparable to heat pipes or thermosyphons while eliminating the need for separate passive cooling devices, thereby reducing device complexity and space requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient thermal management and power supply to electronic devices, reducing operating temperatures and increasing package density by integrating thermal and electrical conductivity, thus improving the reliability and performance of high-power electronic devices.
Implementation Method 1
a thermally conductive element in thermal contact with the one or more electronic devices
Implementation Method 2
a multilayer coating system including two or more layers, said two or more layers being a sequence of electrically insulating and electrically conductive layers integrally formed on a portion of the thermally conductive element, said electrically conductive layers providing one or more paths for supplying electric current to the one or more electronic devices
Data Source
AI summary
The present invention provides a thermally and electrically conductive apparatus that can provide both thermal conductivity and electrical conductivity for one or more electronic devices connected thereto. The apparatus comprises a thermally conductive element that is in thermal contact with one or more electronic devices and optionally in contact with a heat dissipation system. A portion of the thermally conductive element is surrounded by a multilayer coating system comprising two or more layers. The multilayer coating system includes alternating electrically insulating and electrically conductive layers in order to provide paths for the supply of electric current to the one or more electronic devices. A conductive layer of the multilayer coating system may be selectively patterned to connect to one or more electronic devices. In this manner, the combination of an electronic circuit carrier and a thermally conductive element can unify thermal conductivity with the provision of power and/or communication into a single integrated unit for use with electronic devices.