Thermally Conductive Element in Integrated Device Package

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Solution Overview

Problem

Integrated device packages face challenges in effectively transferring heat away from electrical components due to limited space for routing, particularly in ball grid array (BGA) and land grid array (LGA) packages.

Innovation Solution

Incorporating a thermally conductive element, such as a heat sink, coupled to the integrated device die and partially embedded in molding material, with interconnects extending through the molding material to provide both thermal and electrical connections to external devices, enhancing heat dissipation and component connectivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a thermally conductive element is added to transfer heat from the integrated device die, then heat dissipation capability is improved, but device complexity increases

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoiddevice complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent combines multiple functions into the thermally conductive element: it serves as both a heat transfer pathway and an electrical interconnect. The element is thermally coupled to the integrated device die to conduct heat away, while also providing electrical connection between the die and external devices, thereby reducing the need for separate thermal and electrical pathways

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The thermally conductive element is designed to perform multiple functions simultaneously: thermal conduction, electrical conduction, and mechanical support. This multi-functional design allows a single component to address heat dissipation needs while maintaining electrical connectivity, thus improving thermal management without proportionally increasing device complexity

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If interconnects are extended through molding material to provide external connections, then connectivity is improved, but manufacturing complexity increases

Engineering Contradiction:

ImproveconnectivityVSAvoidmanufacturing complexity

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The interconnects are pre-formed and positioned before the molding material is applied. This preliminary positioning allows the interconnects to be accurately placed to provide both thermal and electrical pathways, and then the molding material is applied to encapsulate and protect these pre-positioned interconnects, simplifying the overall manufacturing process

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The molding material serves as an intermediary that encapsulates the interconnects while allowing them to extend through it. This intermediary material protects the interconnects during manufacturing and operation, provides mechanical support, and allows the interconnects to maintain their pathways for both thermal and electrical conduction without direct exposure

Inventive Principle:

Principle #24Intermediary (Mediator)

3Temperature

If the thermally conductive element is partially embedded in molding material, then thermal management is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improvethermal managementVSAvoidmanufacturing precision

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The thermally conductive element is partially embedded in the molding material rather than fully encapsulated. This partial embedding provides localized thermal management where it is most needed - in direct contact with the integrated device die - while leaving other portions exposed or accessible for thermal interface materials or heat sinks, thereby optimizing thermal performance without requiring complete precision embedding throughout

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively spreads heat generated by electrical components and provides reliable external connections, improving thermal management and operational efficiency in constrained package geometries.

Implementation Method 1

a thermally conductive element that is coupled to the second side of the integrated device die

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11296005B2Integrated device package including thermally conductive element and method of manufacturing same

Publication Date: 2022.04.05 ANALOG DEVICES INC

AI summary

An integrated device package is disclosed. The integrated device package can include a substrate that has an upper side and a lower side opposite the upper side. The integrated device package can include an integrated device die that is mounted to the lower side of the substrate. The integrated device die has a first side facing the lower side of the substrate and a second side opposite the first side. The package can include a molding material in which the integrated device die is at least partially embedded. The package can include a thermally conductive element coupled to the second side of the integrated device die. At least a portion of the thermally conductive element can be exposed through the molding material. The thermally conductive element can be a heat sink. The package can include an interconnect that is configured to provide an external connection. The interconnect extends at least partially through the molding material from the lower side of the substrate.