Thermally Conductive Gel Composition Preventing Dripping
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Liquid thermally conductive greases often experience dripping or pump-out phenomena when applied, leading to voids and reduced adhesiveness, which increases heat resistance and can cause insulation failure.
Innovation Solution
A composition containing a specific compound with a polyoxyalkylene chain and a (meth)acrylamide compound, which forms a cured product with excellent heat resistance when used in a solid form, including a thermally conductive filler and a coupling agent, to prevent dripping and enhance adhesiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid thermally conductive grease is used, then heat conduction is promoted, but dripping or pump-out phenomenon occurs leading to increased heat resistance
Solution Approach 1:
The patent changes the physical state parameter of the thermally conductive material from liquid to solid form. The composition uses a polymerizable compound that remains liquid during application but cures to form a solid gel structure, eliminating dripping and pump-out while maintaining thermal conduction pathways through the filler network
Solution Approach 2:
The patent creates a composite material system consisting of a polymerizable compound (forming gel structure), thermally conductive filler (providing heat conduction pathways), and coupling agent (enhancing interfacial bonding). This composite structure combines the advantages of liquid application with solid-form stability and high heat resistance
2Ease of operation
If liquid thermally conductive grease is used, then application is easy, but pump-out phenomenon occurs due to member deformation
Solution Approach 1:
The patent introduces a dynamic property where the material transitions from a liquid state during application (easy to spread) to a solid gel state after curing (resistant to deformation). This temporal state change allows the material to be easily applied first, then lock in place to resist pump-out when members deform under thermal expansion or mechanical stress
3Object-generated harmful factors
If solid form thermally conductive material is used, then dripping is suppressed, but heat resistance requires high temperature stability
Solution Approach 1:
The patent utilizes the curing parameter change where the polymerizable compound transforms from liquid to solid gel through polymerization. This phase transition creates a stable solid structure that suppresses dripping while the crosslinked gel network and thermally conductive filler maintain high temperature stability and heat resistance under thermal stress
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively suppresses dripping and pump-out, maintaining excellent heat resistance and adhesiveness, even under high temperatures, thus preventing insulation failure and ensuring efficient heat dissipation.
Implementation Method 1
a cured product of a composition containing a specific compound having a polyoxyalkylene chain and two (meth)acryloyl groups and a specific (meth)acrylamide compound
Implementation Method 2
this material reduces heat resistance between a heat source and a heat dissipation member and promotes heat conduction from the heat source
Data Source
AI summary
A composition containing a compound represented by the following Formula (1):[in the Formula (1), R11 and R12 each independently represent a hydrogen atom or a methyl group; and R13 represents a divalent group having a polyoxyalkylene chain]; anda compound represented by the following Formula (2):[in the Formula (2), R21 and R22 each independently represent a hydrogen atom or a monovalent organic group, and R21 and R22 may be bonded to each other to form a ring; and R23 represents a hydrogen atom or a methyl group].