Thermally Conductive Ink Layer for Printed Circuit Board Heat Dissipation
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Solution Overview
Problem
Conventional printed circuit boards face performance degradation due to heat accumulation of electronic elements, and existing solutions like external heat-dissipation fins and fans increase assembly costs, occupy space, and cause electromagnetic interference.
Innovation Solution
A printed circuit board design incorporating a substrate with an electrically conductive pattern layer and a thermally conductive ink layer, where the thermally conductive ink layer covers the wire portion and exposes the contact portion, composed of thermally conductive powder and colloidal adhesive with a weight percentage of thermally conductive powder less than 10% and colloidal adhesive higher than 80%, replacing the conventional solder mask to enhance thermal conduction while maintaining insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If external heat-dissipation elements (fans, heat-dissipation fins) are adopted, then heat dissipation performance is improved, but assembly costs increase and electromagnetic interference occurs
Solution Approach 1:
The patent merges the thermal conduction function with the existing solder mask layer by incorporating thermally conductive powder into the ink layer composition. This integration eliminates the need for separate external heat-dissipation elements while maintaining thermal management functionality, thereby avoiding electromagnetic interference issues.
Solution Approach 2:
The solder mask layer is transformed into a multi-functional layer that simultaneously provides electrical insulation and thermal conduction. By adding thermally conductive powder to the ink layer, the same layer performs both its traditional insulation function and a new thermal management function, eliminating the need for dedicated heat-dissipation components.
2Temperature
If external heat-dissipation elements are adopted, then heat dissipation performance is improved, but assembly costs increase and space is occupied
Solution Approach 1:
The thermal conduction function is merged into the existing solder mask layer structure, eliminating the need for separate heat-dissipation components. This integration reduces the number of parts and simplifies the assembly process, thereby reducing assembly costs and avoiding the space occupation of external elements.
Solution Approach 2:
The solder mask layer becomes a multi-functional layer that provides both electrical insulation and thermal conduction. This universalization of the layer's function eliminates the need for additional dedicated heat-dissipation components, reducing device complexity and assembly requirements.
3Object-affected harmful factors
If conventional solder mask is used, then electrical insulation is maintained, but thermal conduction is insufficient
Solution Approach 1:
The ink layer is formulated as a composite material combining thermally conductive powder (such as aluminum nitride or boron nitride) with colloidal adhesive. This composite structure maintains the electrical insulation properties of the solder mask while introducing superior thermal conduction capability through the thermally conductive powder particles.
Solution Approach 2:
The thermal conduction parameter of the solder mask layer is enhanced by incorporating thermally conductive powder into the ink layer composition. This parameter change transforms the layer from having poor thermal conduction to having improved thermal conduction, while maintaining electrical insulation through proper material selection and composition control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively addresses heat accumulation issues in printed circuit boards, improving thermal dissipation without increasing assembly costs or causing electromagnetic interference, thereby maintaining product performance.
Implementation Method 1
a thermally conductive ink layer (160) covering the wire portion (144) and exposing the contact portion (142). The thermally conductive ink layer (160) includes a thermally conductive powder (162) and a colloidal adhesive (164)
Data Source
AI summary
A printed circuit board is provided. The printed circuit board includes a substrate, an electrically conductive pattern layer, and a thermally conductive ink layer. The substrate includes a first surface. The electrically conductive pattern layer is located on the first surface and includes a contact portion and a wire portion. The thermally conductive ink layer covers the wire portion and exposes the contact portion. The thermally conductive ink layer includes a thermally conductive powder and a colloidal adhesive, where a weight percentage of the thermally conductive powder is less than 10%, and a weight percentage of the colloidal adhesive is higher than 80%. An electronic device including the printed circuit board is further provided.