Thermally Conductive Interposer for Active Optical Device Thermal Management
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Solution Overview
Problem
Active optical devices (AODs) in systems like SoC or SoP face temperature challenges due to proximity to heat-dissipating IC chips, leading to reduced performance and longevity, as conventional substrates with low thermal conductivity hinder effective heat dissipation.
Innovation Solution
Employing a thermally conductive interposer between the AOD and the substrate, coupled with a thermally isolated heat sink, to facilitate heat transfer away from the AOD, thereby maintaining the AOD's operating temperature below desired levels and reducing thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional substrate with low thermal conductivity is used to mount the AOD, then the device complexity is reduced, but the AOD operating temperature increases and performance deteriorates
Solution Approach 1:
A thermally conductive interposer is introduced as an intermediary component between the AOD and the conventional substrate. The interposer has high thermal conductivity to conduct heat away from the AOD, while the conventional substrate maintains its low complexity. This mediator resolves the contradiction by providing thermal management without requiring the main substrate to be complex.
Solution Approach 2:
The mounting structure is segmented into three distinct components: the AOD, the thermally conductive interposer, and the conventional substrate. This segmentation allows each component to be optimized independently - the interposer for thermal conductivity and the substrate for structural simplicity - thereby resolving the contradiction between temperature control and device complexity.
2Area of stationary object
If the AOD is placed in close proximity to the IC chip, then the device area is reduced, but the AOD temperature increases due to heat from the IC chip
Solution Approach 1:
The thermally conductive interposer serves as a heat transfer mediator between the AOD and the heat sink, enabling the AOD to be positioned close to the IC chip for compactness while the interposer conducts heat away from the AOD to maintain its operating temperature.
3Loss of energy
If a thermally conductive interposer is introduced between the AOD and substrate, then heat dissipation is improved, but the device complexity increases
Solution Approach 1:
The interposer is a specialized intermediary component designed specifically for thermal management. While it does increase component count, its function is singular and well-defined (heat conduction), making the complexity increase manageable and justified by the significant improvement in heat dissipation and AOD performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This setup effectively reduces the AOD's operating temperature, extending its operational life by maintaining it at or below desired levels and enhancing heat dissipation, thereby improving performance and longevity.
Implementation Method 1
a thermally conductive interposer positioned between the AOD and the substrate such that heat generated by the AOD is drawn away from the AOD and toward a lower temperature reservoir
Implementation Method 2
coupled with a thermally isolated heat sink, to facilitate heat transfer away from the AOD
Data Source
AI summary
A device can include an active optical device (AOD) to at least one of transmit and receive optical signals. The device can also include an interposer having the AOD mounted thereon. The interposer can be in thermal contact with a heat sink and the interposer is mounted on a substrate. The interposer can be formed of a thermally conductive and electrically insulating material. The interposer can include a via to electrically couple the AOD to another electrical device.