Thermally Conductive Layer for Semiconductor Heat Dissipation
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Solution Overview
Problem
Microelectronics device packages face poor heat dissipation due to the low thermal conductivity of molding compounds, which can lead to localized overheating, chip cracking, and handling issues during processing.
Innovation Solution
A method involving the deposition of an insulating barrier layer and a thermally conductive layer with high thermal conductivity (3 W/m-K to 10 W/m-K) to encapsulate chips, providing an efficient heat dissipation path, replacing traditional molding compounds and preventing delamination during processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a traditional molding compound is used to encapsulate the wafer, then the wafer is protected and encapsulated, but the thermal conductivity is low (0.6-0.8 W/m-K) which hinders heat dissipation
Solution Approach 1:
The patent uses a composite material consisting of a polymer matrix combined with thermally conductive fillers (such as aluminum oxide, aluminum nitride, or beryllium oxide particles) to create an encapsulant that provides both mechanical protection and enhanced thermal conductivity. This composite structure allows the material to simultaneously protect the wafer while efficiently conducting heat away from the semiconductor devices.
2Temperature
If a back-side grinding process is applied to reduce molding compound thickness for heat dissipation, then heat dissipation path is improved, but the molding compound becomes delaminated from the wafer
Solution Approach 1:
The patent changes the material parameters of the encapsulant by incorporating thermally conductive fillers into the polymer matrix, thereby improving thermal conductivity without requiring reduction of the encapsulant thickness. This parameter change allows the full thickness of the encapsulant to be retained while still achieving effective heat dissipation, thus maintaining the structural integrity and adhesion of the molding compound to the wafer.
3Temperature
If the molding compound thickness is reduced through grinding, then heat dissipation efficiency is improved, but chip edges become susceptible to cracking and chipping during dicing
Solution Approach 1:
The patent employs a composite encapsulant material with enhanced thermal conductivity that allows the use of sufficient thickness to provide mechanical support and protection to the chip edges during dicing and handling, while simultaneously achieving effective heat dissipation. The composite structure provides both the mechanical strength needed for processing and the thermal conductivity needed for heat management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively increases heat dissipation efficiency, reduces thermal resistance, and prevents chip damage by using a thermally conductive layer as a heat spreader, enhancing the reliability and performance of microelectronics devices.
Implementation Method 1
a thermally conductive layer is formed over the insulating barrier layer to at least partially encapsulate the at least one chip. The thermally conductive layer provides a thermally conductive path through which heat that is generated from the chip is dissipated to the ambient
Data Source
AI summary
A semiconductor package includes a wafer and at least one chip attached on first portions of an upper surface of the wafer. Further, the semiconductor package includes an insulating barrier layer, a thermally conductive layer, and a heat sink. The insulating barrier layer is arranged over the at least one chip attached on first portions of an upper surface of the wafer. The thermally conductive layer is arranged over the insulating barrier layer and at least partially encapsulates the at least one chip. The heat sink is arranged over the thermally conductive layer.