Thermally Conductive Lead Frame Structure for Shorter Heat Paths
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Solution Overview
Problem
Conventional thermally conductive devices have issues with inefficient heat transfer due to excessive distance between electrodes, small contact area, and inconsistent performance from solder usage, leading to compromised thermal conduction efficiency.
Innovation Solution
A thermally conductive device with a lead frame structure featuring two thermally conductive lead frames attached to an electrically insulating layer, with bent leads extending beyond the layer's sidewalls, increasing the cross-sectional area and reducing the conductive path thickness, thereby enhancing thermal conduction efficiency without the need for excessive solder.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electrodes are placed on the right and left sides of the thermally conductive device, then the electrodes can be electrically isolated through an insulating layer, but the distance between the electrodes becomes excessively large, reducing thermal conduction efficiency
Solution Approach 1:
The patent transitions from a planar arrangement where electrodes are positioned on opposite sides to a three-dimensional configuration where electrodes are stacked vertically. This dimensional change allows the electrodes to be closer in the vertical direction while maintaining electrical isolation through the insulating layer, thereby reducing the effective thermal conduction path length without compromising electrical isolation.
Solution Approach 2:
The patent employs a nested structure where the insulating layer is positioned between the two electrodes in a stacked configuration. This nesting arrangement allows the electrodes to be in close proximity while the insulating layer provides electrical isolation, effectively solving the contradiction between shortening the distance and maintaining isolation.
2Length of moving object
If the distance between the electrodes is reduced to improve thermal conduction, then thermal efficiency improves, but the contact area between the electrodes and the insulating layer becomes insufficient, compromising electrical isolation
Solution Approach 1:
By stacking electrodes vertically rather than placing them horizontally, the patent reduces the distance between electrodes in the vertical direction while the insulating layer provides sufficient contact area for electrical isolation. This dimensional reconfiguration allows both short distance and adequate contact area to coexist.
3Reliability
If a significant amount of solder is used to cover the electrodes to enhance thermal conduction, then thermal conduction improves, but the performance becomes inconsistent during mass production due to difficulty in precisely controlling the solder usage amount
Solution Approach 1:
The patent extracts the solder from the thermal conduction path by designing a structure where the insulating layer itself provides the thermal conduction function. This eliminates the need for excessive solder and the associated manufacturing precision issues, while maintaining reliable thermal conduction through the carefully controlled insulating layer.
Solution Approach 2:
The insulating layer serves as an intermediary that performs both electrical isolation and thermal conduction functions. By using this intermediary material with controlled properties, the patent achieves consistent thermal conduction without relying on variable solder amounts, thereby improving manufacturing precision.
4Area of stationary object
If the cross-sectional area perpendicular to the heat flow direction is enlarged to increase heat conduction capacity, then thermal conduction efficiency improves, but the device thickness increases
Solution Approach 1:
The patent utilizes the vertical dimension to stack multiple functional layers (electrodes and insulating layers) to achieve the required cross-sectional area for heat conduction. This vertical stacking allows the device to maintain a compact horizontal footprint while providing sufficient thermal conduction area, effectively decoupling the relationship between cross-sectional area and device thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The lead frame structure significantly improves thermal conduction efficiency by enlarging the cross-sectional area perpendicular to the heat flow direction, shortening the conductive path, and reducing the reliance on solder, ensuring consistent performance.
Implementation Method 1
the electrically insulating but thermally conductive layer 11 is made of a ceramic material, by which the electrode 10 is electrically isolated from the electrode 12... heat prioritizes the thermally conductive device 100 as its thermally conductive path
Implementation Method 2
The first thermally conductive lead frame has a metal plate and a lead extended from the metal plate... The second thermally conductive lead frame has a metal plate and a lead extended from the metal plate
Data Source
AI summary
A thermally conductive device includes an electrically insulating but thermally conductive layer, a first thermally conductive lead frame, and a second thermally conductive lead frame. The electrically insulating but thermally conductive layer has a top surface, a bottom surface, and a sidewall therebetween. The first thermally conductive lead frame has a top metal plate, a first extending part, and a second extending part. The top metal plate is disposed on the top surface. The first extending part horizontally extends from the top metal plate and goes beyond the sidewall. The second extending part extends from the first extending part and goes beyond the bottom surface. The second thermally conductive lead frame has a bottom metal plate and a third extending part. The bottom metal plate is disposed on the bottom surface. The third extending part extends downward from the bottom metal plate.