Thermally Conductive Material Composition for Heat Dissipation and Adhesion
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Solution Overview
Problem
Existing thermally conductive materials struggle to effectively manage heat dissipation from miniaturized power semiconductor devices, necessitating improved thermal conductivity and adhesion properties.
Innovation Solution
A composition comprising a compound represented by General Formula (1), a phenolic compound, and an inorganic substance, with a compound content of 30% by mass or greater, enhances thermal conductivity and adhesion, utilizing a radially extending structure to minimize microbubbles and increase crosslink density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional thermally conductive materials are used, then heat dissipation is partially achieved, but thermal conductivity is insufficient for miniaturized power semiconductor devices
Solution Approach 1:
The patent uses a composite material system comprising a phenolic resin base compound, a polyhydric alcohol compound with specific molecular weight ratio (0.2-2.0), and inorganic filler. This composite structure achieves superior thermal conductivity by optimizing the interaction between organic matrix and inorganic filler, resolving the contradiction between thermal conductivity and heat dissipation effectiveness.
Solution Approach 2:
The patent optimizes specific parameters including the molecular weight ratio of polyhydric alcohol compound (0.2-2.0), content of compound (1) (30-70 mass%), and inorganic filler content (40-80 mass%). These parameter changes enable the material to achieve both high thermal conductivity and effective heat dissipation, resolving the technical contradiction.
2Temperature
If thermally conductive material is applied, then thermal conductivity is improved, but adhesion properties deteriorate
Solution Approach 1:
The patent introduces a silane coupling agent that locally modifies the interface between the organic resin matrix and inorganic filler. This local quality change at the interface provides both thermal conduction pathways and chemical bonding sites, simultaneously improving thermal conductivity and adhesion strength.
Solution Approach 2:
The silane coupling agent acts as an intermediary substance between the organic phenolic resin and inorganic filler particles. It provides bridging functionality that enhances interfacial adhesion while maintaining thermal conductivity, resolving the contradiction between these two properties.
3Temperature
If high content of compound (1) is used, then thermal conductivity improves, but microbubbles increase reducing material quality
Solution Approach 1:
The patent employs a preliminary degassing process and optimizes mixing sequence to remove trapped air and volatiles before curing. This preliminary action prevents microbubble formation even when using high content of compound (1) for enhanced thermal conductivity.
Solution Approach 2:
The patent ensures continuous and homogeneous mixing of all components under controlled conditions, preventing air entrapment and ensuring uniform distribution of compound (1). This continuous action maintains high thermal conductivity while minimizing microbubble formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves thermally conductive materials with improved thermal conductivity and insulating properties, effectively managing heat dissipation from miniaturized power semiconductor devices.
Implementation Method 1
the film is flowable and crosslinkable
Implementation Method 2
capable of transmitting thermal energy from the heat-generating device to the heat-dissipating component
Implementation Method 3
a phenolic compound
Data Source
AI summary
A composition for forming a thermally conductive material contains a compound represented by General Formula (1), a phenolic compound, and an inorganic substance, in which a content of the compound represented by General Formula (1) is 30.0% by mass or greater with respect to a total organic solid content,(X—Z1—)m-A-(—Z2—Y)n (1).