Thermally Conductive Material Cooling for Electronic Devices

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Solution Overview

Problem

Electronic devices such as set top boxes and digital video recorders face challenges with heat dissipation due to increased power consumption, as traditional cooling methods like fans and heat pipes are costly, energy-consuming, and limit design flexibility.

Innovation Solution

The use of a thermally conductive material surrounding electronic components within a housing, combined with heat transfer fins on the exterior, which integrates antennas into the fins to enhance both aesthetics and data transmission performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If traditional cooling methods like fans and heat pipes are used, then heat dissipation performance is improved, but device complexity and cost increase

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidcooling system complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates the need for complex cooling components like fans and heat pipes by implementing a simplified cooling approach using thermally conductive material and passive heat transfer fins, thereby reducing device complexity while maintaining heat dissipation functionality

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces active mechanical cooling systems (fans, heat pipes) with a passive thermal management system using thermally conductive material and heat transfer fins, eliminating moving parts and complex mechanisms while achieving effective heat dissipation

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Temperature

If traditional cooling methods like fans and heat pipes are used, then heat dissipation performance is improved, but energy consumption increases

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidenergy consumption

Core Design Contradiction:

TemperatureVSUse of energy by moving object

Solution Approach 1:

The patent implements a self-service cooling system where thermally conductive material and heat transfer fins passively dissipate heat without requiring external energy input, eliminating the need for powered cooling components and reducing energy consumption

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The patent replaces energy-consuming mechanical cooling systems with a passive thermal management system that utilizes natural heat conduction and convection through thermally conductive material and heat transfer fins, achieving effective cooling without additional energy input

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Adaptability or versatility

If antennas are integrated into heat transfer fins, then data transmission and reception are improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improvedata transmission and receptionVSAvoidantenna integration precision

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent merges the antenna structure with the heat transfer fin into a single integrated component, combining wireless communication functionality with thermal management, thereby improving data transmission and reception while managing heat dissipation simultaneously

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent creates a multi-functional component where the heat transfer fin serves dual purposes as both a thermal management element and an antenna structure, enabling the system to perform both heat dissipation and wireless communication functions

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution reduces costs and energy consumption while enabling more compact and attractive designs by effectively dissipating heat without the need for fans or heat pipes, while also improving data transmission capabilities.

Implementation Method 1

a thermally conductive material that surrounds the electronic circuit within the housing, that directly contacts both the at least one electrical component and the one or more interior surfaces of the housing, that absorbs heat from the at least one electrical component, and that transfers heat to the housing

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The plurality of heat transfer fins project outwardly from the wireless communication device, receive heat produced by electric components of the wireless communication device, and transfer heat to air passing the heat transfer fins

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS9247676B2Electronic device cooling systems

Publication Date: 2016.01.26 DIRECTV LLC

AI summary

An electronic device includes: a housing having one or more interior surfaces; an electronic circuit that is disposed within the housing, that does not directly contact any of the one or more interior surfaces of the housing, and that includes at least one electrical component that consumes electrical power; and a thermally conductive material that surrounds the electronic circuit within the housing, that directly contacts both the at least one electrical component and the one or more interior surfaces of the housing, that absorbs heat from the at least one electrical component, and that transfers heat to the housing.