Thermally Conductive Panel Cooling for Compact Electronics Modules
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Solution Overview
Problem
Existing electronic equipment modules face challenges in maintaining high reliability and long lifespan due to heat generation, especially in high ambient temperatures, while also requiring a compact design.
Innovation Solution
The integration of a thermally conductive panel that covers at least two opposite side surfaces of the housing enclosing the circuit board, providing effective cooling and reducing temperature within the module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronics modules are densely packed in a compact design, then space utilization is improved, but heat dissipation becomes more difficult and temperature increases
Solution Approach 1:
The thermally conductive panel extends beyond the front surface of the housing into the surrounding space, creating a three-dimensional heat dissipation structure. This dimensional extension allows heat to be conducted away from the electronics modules in multiple directions, effectively increasing the heat dissipation surface area without increasing the footprint of the module itself.
Solution Approach 2:
The thermally conductive panel acts as an intermediary heat transfer medium between the electronics modules and the surrounding environment. The panel conducts heat away from the modules through its thermally conductive material, serving as a mediator that facilitates heat transfer from the compact module interior to the external cooling environment.
2Temperature
If thermally conductive panels are added to cooling electronics modules, then temperature reduction is improved, but device complexity increases
Solution Approach 1:
The thermally conductive panel serves multiple functions simultaneously: it acts as a heat sink, a structural support element, and a mounting surface for additional electronics modules. By integrating these multiple functions into a single component, the design achieves effective cooling without proportionally increasing device complexity.
Solution Approach 2:
The cooling function is merged with the structural housing elements. The thermally conductive panel is integrated into the housing structure itself rather than being a separate附加 component, combining the structural support function with the thermal management function in a unified design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient temperature reduction, prolongs the lifespan of electronic equipment, allows for a compact design, and is cost-effective, effectively addressing the heat management issues in electronic equipment modules.
Implementation Method 1
The electronics module comprises a thermally conductive panel. The thermally conductive panel at least partly covers at least two opposite side surfaces of the housing.
Data Source
Figure 1(a)~1(b)
Figure 2~5
Figure 4(a)~4(d)
AI summary
There is provided an electronics module(8). The electronics module comprises a circuit board (6). The circuit board comprises electronic equipment. The electronics module comprises a housing (5, 7). The housing encloses the circuit board. The electronics module comprises a thermally conductive panel (9a, 9b, 9c, 9d, 9e). The thermally conductive panel at least partly covers at least two opposite side surfaces of the housing. There is also provided an arrangement (1c) comprising at least two such electronics modules. There is also provided a method for providing such an electronics module.