Thermally Conductive PCB Label for Heat Dissipation
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Solution Overview
Problem
Conventional labels attached to printed circuit boards (PCBs) in memory sub-systems have limited thermal conductivity, hindering effective heat dissipation and cooling, especially as PCBs generate more heat per unit area and space constraints require thinner solutions.
Innovation Solution
The development of thermally conductive circuit labels with a first and second planar portion and multiple tab portions, each comprising a thermal conduction layer, which attach to opposite sides of the PCB, creating conductive paths for heat dissipation while allowing air flow convection cooling, using materials like pyrolytic graphite and copper for enhanced thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional labels are attached to PCBs, then the label provides identification and information, but the label has poor thermal conductivity which hinders heat dissipation
Solution Approach 1:
The label incorporates a thermal conduction layer made of thermally conductive material (such as pyrolytic graphite or metal) combined with an adhesive layer and substrate. This composite structure maintains the label's identification function while adding superior thermal conductivity to enable effective heat dissipation from the PCB surface.
Solution Approach 2:
The patent changes the thermal conductivity parameter of the label by incorporating specific thermally conductive materials and designing the thermal conduction layer with appropriate thickness and thermal conductivity values (e.g., 50-500 W/m·K), transforming the label from a purely informational component to a functional thermal management component.
2Productivity
If PCB density increases to improve productivity, then more components can be packed, but heat generation per unit area increases requiring better cooling
Solution Approach 1:
The label serves multiple functions simultaneously: it provides identification information, acts as a thermal conduction path, and serves as a structural element on the PCB. This multi-functionality allows the same component to contribute to both productivity (through compact design) and thermal management.
Solution Approach 2:
The thermal conduction layer acts as an intermediary between the heat-generating PCB components and the heat dissipation path. It mediates the thermal transfer process, conducting heat away from high-density component areas to designated heat sinks or cooler regions of the PCB.
3Volume of moving object
If space constraints require thinner PCBs, then device size is reduced, but thermal management becomes more challenging
Solution Approach 1:
The thermal conduction layer is designed as a thin film or layer structure that provides effective thermal conduction within the constrained thickness of the PCB. This thin-film approach maintains compact device volume while establishing adequate thermal conduction paths through the use of materials with high thermal conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermally conductive labels effectively transfer heat from the PCB components to the opposite side, improving heat dissipation and maintaining stable operating temperatures, even in high-density and space-constrained environments.
Implementation Method 1
each of the tab portions, the first planar portion, and the second planar portion comprises a thermal conduction layer
Implementation Method 2
allowing air flow convection cooling
Data Source
AI summary
Various embodiments described herein provide a label configured for thermal conductivity and configured to pass over an edge of a printed circuit board (PCB) and attached to both sides of the printed circuit board. The label can be used with a printed circuit board that is associated with a memory sub-system, such as a memory module (e.g., solid state drive, SSD module).