Thermally Conductive Phase Change Microcapsule Shell
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Solution Overview
Problem
Conventional phase change microcapsules face reduced heat transfer rates due to the low thermal conductivity of their encapsulation materials, leading to inefficiencies in heat release and absorption.
Innovation Solution
A process is developed to create phase change microcapsules with a thermally conductive shell by polymerizing vinylsilane compounds with acrylic monomers and incorporating thermally conductive nano-materials like aluminum oxide, aluminum nitride, or silicon carbide, enhancing compatibility and dispersibility to improve heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional organic polymer materials are used as encapsulation materials, then the phase change material is protected from leakage, but the thermal conductivity is very low which decreases the heat transfer rate
Solution Approach 1:
The patent applies composite materials by combining organic polymer encapsulation materials with inorganic thermally conductive materials (such as metal oxides, metal nitrides, or carbon-based materials) to create a composite encapsulation layer. This composite structure maintains the leakage prevention capability of the polymer while introducing high thermal conductivity from the inorganic components, thereby resolving the contradiction between reliability and heat transfer rate.
2Temperature
If phase change materials are applied directly without microencapsulation, then the heat transfer rate is high, but the materials leak or lose due to melting during phase change which reduces the life of the materials
Solution Approach 1:
The patent uses flexible polymer shell materials to encapsulate the phase change material. The shell is thin enough to allow effective heat transfer while providing sufficient mechanical protection to prevent leakage during phase change. The flexibility of the shell accommodates volume changes during melting and solidification, maintaining material stability without significantly impeding heat transfer.
3Temperature
If thermally conductive nano-material is added to the encapsulation material, then the thermal conductivity increases and heat transfer rate improves, but the compatibility and dispersibility of the nano-material in the polymer matrix becomes challenging
Solution Approach 1:
The patent employs parameter changes by modifying the surface properties of thermally conductive nano-materials through surface treatment or functionalization. This changes the surface energy and chemical characteristics of the nano-materials, improving their compatibility with the organic polymer matrix and enabling uniform dispersion. The parameter change in surface properties resolves the contradiction between achieving high thermal conductivity and maintaining compositional stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting phase change microcapsules exhibit increased thermal conductivity, enabling faster heat absorption and release, and effective heat dissipation and energy storage.
Implementation Method 1
the vinylsilane compound is polymerized with the acrylic monomer to form a copolymer
Implementation Method 2
adds a thermally conductive nano-material in the encapsulation material to increase the thermal conductivity, thereby speeding up the heat release or absorption
Implementation Method 3
The phase change materials (PCM) are known to be materials that can change from a solid phase to a liquid phase or from a liquid phase to a solid phase, and during the phase change, a substantially amount of latent heat is absorbed or released
Implementation Method 4
the thermally conductive inorganic material is added for the polar functional groups on the surface of the thermally conductive nano-material to condense with the vinylsilane compound and form chemical bonding
Data Source
AI summary
A process for preparing a phase change microcapsule having a thermally conductive shell is introduced. The thermal conductivity of the encapsulation materials for the phase change microcapsules is increased by adding thermally conductive nano-materials. The vinylsilane compound is polymerized with the acrylic monomer to form the copolymer first, and then the thermally conductive inorganic material is added. Thereafter, the phase change microcapsule having the phase change material as the core and the thermally conductive material-containing copolymer as the shell is prepared. The polar functional groups on the surface of the thermally conductive inorganic material condense with the vinylsilane compound to form chemical bonding, thereby substantially increasing the compatibility between the thermally conductive inorganic material and the copolymer. Therefore, the thermally conductive material can be dispersed stably during the encapsulation of the microcapsules, and the phase change microcapsule having the thermally conductive shell can be obtained successfully.