Thermally Conductive Plastic Enclosure for Heat Dissipation and Vibration Damping
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current solutions for electronic device mounting and enclosures that combine vibration damping with heat dissipation are often optimized for only one aspect, resulting in either high manufacturing costs, inefficient cooling, or marginal performance in thermal transfer and vibration damping.
Innovation Solution
The use of thermally conductive plastics as a mounting assembly that acts as a physical and thermal intermediary between electronic devices and supporting structures, enabling efficient heat transfer and vibration damping while reducing the need for air exchange cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional separate mounting and cooling solutions are used, then manufacturing cost is reduced, but thermal transfer efficiency deteriorates
Solution Approach 1:
The patent combines the mounting structure and heat dissipation function into a single integrated thermally conductive plastic assembly. The mounting structure includes thermal pathways that directly conduct heat from electronic components to external heat sinks, eliminating the need for separate cooling components and reducing manufacturing complexity while improving thermal transfer efficiency.
Solution Approach 2:
The thermally conductive plastic mounting assembly serves multiple functions simultaneously: it provides mechanical support for electronic components, acts as a thermal conduit for heat dissipation, and structures the overall device architecture. This multi-functionality reduces the number of separate components needed while maintaining effective cooling.
2Ease of manufacture
If traditional separate mounting and vibration damping solutions are used, then manufacturing cost is reduced, but vibration damping performance deteriorates
Solution Approach 1:
The patent integrates vibration damping features directly into the mounting structure by incorporating viscoelastic materials and damping elements within the thermally conductive plastic assembly. This integration provides effective vibration isolation for sensitive electronic components without requiring separate damping components, thereby maintaining manufacturing simplicity while improving reliability.
3Temperature
If air exchange cooling is used, then heat dissipation is achieved, but system density is reduced
Solution Approach 1:
The patent extracts the air exchange cooling mechanism and replaces it with direct thermal conduction pathways through the mounting structure. By removing the dependency on air flow for heat dissipation, the design eliminates the need for large ventilation spaces and achieves effective cooling in a more compact form factor, thereby increasing system density.
4Ease of manufacture
If optimized single-function mounting is used, then manufacturing cost is reduced, but overall performance deteriorates
Solution Approach 1:
The patent designs the mounting assembly to simultaneously provide mechanical support, thermal management, and vibration damping functions. This multi-functional approach consolidates multiple performance requirements into a single component that can be manufactured cost-effectively while delivering superior overall device performance and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach leads to improved electronic device performance with longer life, higher reliability, lower maintenance, and reduced manufacturing costs, allowing for higher system density designs and better heat dissipation control.
Implementation Method 1
thermally conductive plastic assembly that provides for thermal conduction and vibration damping of an electronic device
Implementation Method 2
thermally conductive plastic assembly that provides for thermal conduction and vibration damping of an electronic device
Data Source
AI summary
A system and method for heat dissipation and vibration damping of electronic devices in which an assembly is formed by one or more surfaces comprised of at least one material that is a thermally conductive plastic that combines to partially or completely enclose one or more electronic devices as a physical and thermal intermediary between the electronic devices and supporting structures.