Thermally Conductive Polymer Composition for Camera Modules
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Solution Overview
Problem
The increased complexity of camera modules leads to higher power consumption and heat production, which can cause malfunctions due to the heat sensitivity of polymeric components, necessitating a thermally conductive polymer composition to manage heat effectively.
Innovation Solution
A polymer composition with an in-plane thermal conductivity of 2.0 W/m-K or more, comprising an aromatic polymer, an inorganic filler material with a hardness of 2.5 or more, and thermally conductive particulate material with specific size and distribution, enhancing mechanical strength and surface smoothness while managing heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional polymeric components are used in camera modules, then manufacturing ease and cost are maintained, but heat dissipation capability deteriorates leading to malfunctions
Solution Approach 1:
The patent applies composite materials by combining aromatic polymer base resin with thermally conductive inorganic fillers (such as aluminum oxide, aluminum nitride, or boron nitride particles) to create a polymer composition with enhanced thermal conductivity. This composite structure allows the material to dissipate heat effectively while maintaining the processing advantages and cost benefits of polymeric materials, thereby preventing malfunctions caused by heat accumulation in camera modules.
2Temperature
If thermally conductive fillers are added to polymer composition, then heat transfer capability is improved, but mechanical strength and surface quality may deteriorate
Solution Approach 1:
The patent applies parameter changes by carefully controlling the particle size, size distribution, and concentration of thermally conductive fillers within specific ranges. The fillers are sized between 0.1-10 micrometers with a controlled size distribution to optimize thermal conductivity while minimizing negative effects on mechanical properties. Additionally, the patent specifies precise composition ratios (e.g., 10-50 parts inorganic filler per 100 parts aromatic polymer) to balance thermal performance with mechanical strength and surface quality.
Solution Approach 2:
The patent applies local quality by creating heterogeneous distribution of fillers with different sizes and thermal conductivities within the polymer matrix. This allows regions with higher filler concentration to provide enhanced heat dissipation where needed, while other regions maintain better mechanical continuity and strength. The use of multi-sized particles (0.1-10 micrometer range) creates a packed structure that optimizes both thermal pathways and mechanical integrity locally throughout the material.
3Reliability
If complex camera module designs with more moving parts are implemented, then picture quality is improved, but power consumption and heat production increase
Solution Approach 1:
The patent applies the blessing in disguise principle by converting the harmful effect of increased heat production (resulting from higher power consumption in complex dual-camera modules) into a manageable condition. By incorporating thermally conductive fillers that create efficient heat dissipation pathways, the patent transforms the heat problem into an opportunity to demonstrate enhanced thermal management capability, allowing complex high-performance camera designs to operate reliably without thermal malfunctions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polymer composition effectively reduces heat buildup in camera modules by creating a thermal pathway for heat transfer, preventing 'hot spots' and maintaining mechanical properties and surface quality, thus preventing malfunctions.
Implementation Method 1
a polymer composition is disclosed that has an in-plane thermal conductivity of about 2.0 W/m-K or more... creates a thermal pathway for heat transfer away from a part
Data Source
AI summary
A polymer composition that has an in-plane thermal conductivity of about 2.0 W/m-K or more is provided. The composition comprises 100 parts by weight of at least one aromatic polymer; from about 10 to about 50 parts by weight of an inorganic material having a hardness value of about 2.5 or more based on the Mohs hardness scale; and from about 20 to about 80 parts by weight of a thermally conductive particulate material having an average size of from about 1 to about 100 micrometers.