Thermally Conductive Polymer Composition Void Reduction
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Solution Overview
Problem
Thermal conductive molded articles filled with high volumes of inorganic particles often exhibit reduced thermal conductivity and strength due to air bubble formation and voids, which compromise their electrical insulation and mechanical properties.
Innovation Solution
A thermal conductive polymer composition incorporating boron nitride particles in an aggregated state and a second component with a specific particle size distribution, combined with an electrically insulating polymer, to enhance fluidity and reduce void formation during molding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a high volume of inorganic particles is incorporated into the polymer composition to improve thermal conductivity, then thermal conductivity is enhanced, but fluidity deteriorates and air bubble formation increases
Solution Approach 1:
The patent changes the particle size parameter of inorganic particles, specifically using particles with a volume average particle diameter of 10 μm or more. This parameter change improves fluidity while maintaining thermal conductivity by reducing particle aggregation and improving dispersion in the polymer matrix.
Solution Approach 2:
The patent applies local quality by creating a specific particle size distribution where larger particles (10 μm or more) are used to ensure fluidity, while still incorporating sufficient inorganic particle content to maintain thermal conductivity. This local optimization of particle characteristics resolves the contradiction between thermal performance and processability.
2Temperature
If a high volume of inorganic particles is incorporated into the polymer composition to improve thermal conductivity, then thermal conductivity is enhanced, but void formation increases reducing strength and electrical insulation
Solution Approach 1:
The patent changes the particle size parameter to volume average particle diameter of 10 μm or more, which prevents void formation by improving fluidity and reducing air bubble entrapment during molding. This maintains both thermal conductivity and structural integrity.
Solution Approach 2:
The patent takes preliminary action by pre-selecting inorganic particles with appropriate size characteristics before incorporation into the polymer composition. This preliminary sizing prevents subsequent void formation and ensures reliable mechanical and electrical properties in the final molded article.
3Temperature
If inorganic particles are packed in a closest packing state to maximize thermal conductivity, then thermal conductivity is improved, but manufacturing complexity increases due to processing difficulties
Solution Approach 1:
The patent changes the particle size parameter to volume average particle diameter of 10 μm or more, which naturally prevents closest packing while maintaining good thermal conductivity. This simplifies manufacturing by improving fluidity and reducing the need for complex processing controls.
Solution Approach 2:
Instead of pursuing closest packing to maximize thermal conductivity, the patent inverts the approach by using larger particles that naturally prevent close packing. This inversion simplifies manufacturing while still achieving excellent thermal conductivity through improved particle dispersion and reduced void formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent thermal conductivity and reduced void formation, leading to improved mechanical strength and electrical insulation in thermal conductive molded articles.
Implementation Method 1
thermal conductive inorganic particles... boron nitride particles... exhibiting particularly high thermal conductivity
Data Source
Figure 1(A)~1(B)
AI summary
The present invention provides a thermal conductive polymer composition with low probability for mixing of an air bubble in a thermal conductive molded article, which is a thermal conductive polymer composition including thermal conductive inorganic particles having a specific particle size distribution and an electrically insulating polymer.