Device for supporting and fastening heating pipes of a heating system placed in subfloors, walls or ceilings of buildings
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Solution Overview
Problem
Existing floor heating systems exhibit increased thermal inertia, causing a delay in heat transfer to rooms, particularly when used intermittently, due to the thermal insulation properties of materials like polymer laminar bodies with bosses.
Innovation Solution
A device for supporting and fastening heating pipes in subfloors, walls, or ceilings made from a mixture of thermoplastic polymers and thermally conductive inorganic fillers, such as graphite or ceramics, which enhances thermal conductivity and improves heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If polymer laminar bodies with bosses are used for fastening heating pipes, then the fastening of heating pipes is achieved, but thermal inertia increases causing delay in heat transfer to rooms
Solution Approach 1:
The patent applies composite materials by combining polymer laminar body with thermally conductive inorganic fillers (such as graphite, aluminum oxide, or metal powders) to create a support device that maintains fastening capability while significantly improving thermal conductivity. This composite structure allows the device to both secure heating pipes and efficiently transfer heat to the room, eliminating the thermal inertia problem of pure polymer materials.
2Loss of energy
If thermally insulating materials are used for floor heating systems, then thermal insulation between slab and screed is achieved, but heat transfer to room is delayed
Solution Approach 1:
The patent applies local quality by creating a device with spatially varying thermal properties: the polymer laminar body provides thermal insulation in certain areas (between slab and screed), while the thermally conductive inorganic fillers create thermal pathways in critical heat transfer zones. This localized differentiation allows simultaneous achievement of thermal insulation where needed and efficient heat transfer where required.
3Reliability
If traditional floor heating systems are installed, then heating coverage is achieved, but living space is reduced
Solution Approach 1:
The patent applies flexible shells and thin films by using a thin polymer laminar body with integrated fastening elements that can be installed directly on the slab surface. This thin-film approach provides complete heating coverage while occupying minimal space, preserving maximum living space compared to traditional thick insulation layers or exposed piping systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device significantly reduces thermal inertia by efficiently diffusing heat, promoting uniform temperature distribution and faster heating, while minimizing the need for heating pipes and optimizing energy consumption.
Implementation Method 1
a device for supporting and fastening heating pipes of a heating system placed in subfloors, walls or ceilings of buildings, in which such a support and fastening device has increased properties of thermal conductivity
Implementation Method 2
the heat developed by the heating pipes, that is the pipes in which the heated fluid flows or electric heating wires, is transferred to the surrounding room through the structures in which the heating pipes themselves are positioned
Data Source
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AI summary
The invention relates to a device (10) for supporting and fastening heating pipes (20) of a heating system placed in subfloors, walls or ceilings of a building. The device (10) comprises: - a laminar body (1) having a first face (2) and an opposite second face (3), - a plurality of fastening elements (30) made in one piece on the first face of the laminar body and configured to fasten said heating pipes on the first face. The invention is characterized in that both the laminar body and the fastening elements of the device are in a mixture comprising at least one thermoplastic polymer and thermally conductive inorganic fillers.