Thermally Conductive Polysiloxane Composition for Heat Dissipation
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Solution Overview
Problem
Existing thermally conductive silicone resin compositions face challenges in maintaining excellent application properties and preventing slump when filled with high ratios of thermally conductive fillers, while also requiring stability in heat dissipation properties over time.
Innovation Solution
A thermally conductive polysiloxane composition comprising a thermally conductive filler, a siloxane compound, an alkoxysilane compound, a polyorganosiloxane with aliphatic unsaturated groups, a polyorganohydrogensiloxane, and a platinum-based catalyst, with specific blending ratios and the addition of fumed silica treated with a silazane compound to enhance filling efficiency and thixotropic properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the composition is filled with a thermally conductive filler at a high filling ratio to improve thermal conductivity, then the thermal conductivity is improved, but the viscosity increases and application properties deteriorate
Solution Approach 1:
The patent applies surface treatment to the thermally conductive filler particles, changing their surface properties by coating with silicone resin. This parameter change allows the filler to maintain high thermal conductivity while improving dispersion and reducing aggregation, thereby maintaining low viscosity and good application properties even at high filling ratios
Solution Approach 2:
The patent creates a composite structure by combining thermally conductive filler particles with a silicone resin coating layer. This composite approach allows the filler to provide thermal conductivity while the resin matrix provides flexibility and processability, resolving the contradiction between high thermal conductivity and good application properties
2Temperature
If the composition is filled with a thermally conductive filler at a high filling ratio to improve thermal conductivity, then the thermal conductivity is improved, but slump occurs after application
Solution Approach 1:
The patent modifies the surface parameters of the filler particles through silicone resin coating, which changes the interparticle forces and rheological properties. This surface parameter change prevents filler aggregation and maintains compositional stability, preventing slump while maintaining high thermal conductivity at high filling ratios
Solution Approach 2:
The silicone resin coating acts as an intermediary between the thermally conductive filler particles and the base resin matrix. This intermediary layer improves particle dispersion, reduces aggregation, and enhances thixotropic properties, thereby preventing slump while maintaining high filler content for thermal conductivity
3Stability of the object's composition
If fumed silica is added to improve thixotropic properties and control fluidity, then the slump is prevented, but the amount required is large which increases viscosity
Solution Approach 1:
The patent changes the surface parameters of the thermally conductive filler particles by coating with silicone resin, which provides thixotropic properties similar to or better than fumed silica. This alternative parameter change achieves the desired fluidity control and slump prevention without requiring large amounts of additive that would increase viscosity
Solution Approach 2:
The patent extracts the essential function of fumed silica (thixotropic property enhancement) and achieves it through surface-treated filler particles instead. By taking out the specific mechanism of fumed silica and implementing it through a different approach (surface coating), the patent avoids the viscosity penalty associated with adding large amounts of fumed silica
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves low viscosity for excellent application properties, prevents slump, and maintains stable thermal conductivity with minimal change in hardness over time, ensuring effective heat dissipation in complexly shaped electronic devices.
Implementation Method 1
a siloxane compound represented by general formula (1) and an alkoxysilane compound represented by general formula (3)
Implementation Method 2
a siloxane compound represented by general formula (1) and an alkoxysilane compound represented by general formula (3)
Implementation Method 3
a platinum-based catalyst
Implementation Method 4
addition-reaction curing type silicone resin composition
Implementation Method 5
a thermally conductive filler
Implementation Method 6
by adding fumed silica to a silicone resin composition, thixotropic properties can be imparted to the composition to control the fluidity
Data Source
AI summary
The present invention relates to a thermally conductive polysiloxane composition comprising: (A) a thermally conductive filler, (B) a siloxane compound having a specified structure; (C) an alkoxysilane compound having a specified structure; (D) a polyorganosiloxane containing at least one aliphatic unsaturated group per molecule; (E) a polyorganohydrogensiloxane having two or more hydrogen atoms bonded to silicon atoms per molecule; and (F) a platinum-based catalyst.