Thermally Conductive Sheet Composition Triazine Phenolic Curing Control
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Solution Overview
Problem
Existing thermally conductive materials face challenges in achieving both excellent thermal conductivity and handleability in a semi-cured state, particularly when using curing accelerators, as they often result in premature curing and reduced material properties.
Innovation Solution
A composition comprising a phenolic compound with a triazine ring, an epoxy compound, and an inorganic nitride, where the specific compound acts as a curing accelerator, moderating the curing reaction to maintain handleability while enhancing thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a curing accelerator is used to improve thermally conductive properties, then thermal conductivity is improved, but handleability in semi-cured state deteriorates
Solution Approach 1:
The invention changes the chemical structure parameters of the phenolic compound by introducing a triazine ring, which fundamentally alters the curing reaction characteristics. This structural modification enables the curing accelerator to promote thermal conductivity while preventing premature curing, thus maintaining handleability in the semi-cured state.
Solution Approach 2:
The invention creates a composite curing system combining a phenolic compound with a triazine ring and a specific curing accelerator. This composite material approach allows the phenolic compound's unique structure to work synergistically with the curing accelerator, achieving both improved thermal conductivity and maintained handleability that neither component could achieve alone.
2Reliability
If curing reaction is accelerated to improve thermal conductivity, then thermal conductivity is improved, but curing control deteriorates
Solution Approach 1:
The phenolic compound's triazine ring structure changes the kinetic parameters of the curing reaction, creating a more controlled reaction profile. This allows the curing accelerator to enhance thermal conductivity without causing uncontrolled premature curing, maintaining composition stability throughout the curing process.
3Volume of moving object
If thermally conductive material is miniaturized to improve device density, then device density is improved, but heat dissipation control deteriorates
Solution Approach 1:
The invention uses a composite thermally conductive material combining phenolic compound with triazine ring and inorganic nitride filler. This composite structure provides superior thermal conductivity in miniaturized forms, enabling effective heat dissipation control even in high-density, small-scale power semiconductor devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent thermal conductivity and handleability in a semi-cured state, allowing for further curing to produce a high-performance thermally conductive material with improved properties.
Implementation Method 1
a thermally conductive material, which promotes heat dissipation from the power semiconductor device, is used
Implementation Method 2
a composition containing a phenolic compound, an epoxy compound, a compound represented by Formula (1), and an inorganic nitride, wherein the phenolic compound includes a phenolic compound having a triazine ring
Data Source
AI summary
An object of the present invention is to provide a composition capable of forming a thermally conductive material having excellent thermally conductive properties and excellent handleability in a semi-cured state. In addition, another object of the present invention is to provide a thermally conductive material, a thermally conductive sheet, and a device with a thermally conductive layer. The composition of the present invention contains a phenolic compound, an epoxy compound, a compound represented by Formula (1), and an inorganic nitride.