Thermally Conductive Sheet High-Temperature Insulation
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Solution Overview
Problem
Existing semiconductor devices face challenges in maintaining sufficient insulating properties at high temperatures, which affects their performance and reliability, particularly in harsh environments like engine rooms where temperature fluctuations are significant.
Innovation Solution
A thermally conductive sheet is developed using a thermosetting resin and inorganic filler material, optimized to have a low dielectric loss factor and relative dielectric constant, with a high glass transition temperature and controlled ion content, to enhance thermal conductivity and insulating properties, thereby improving the reliability of semiconductor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermosetting resin and inorganic filler material are used to create a thermally conductive sheet, then thermal conductivity is improved, but insulating properties deteriorate at high temperatures
Solution Approach 1:
The patent optimizes specific parameters of the thermosetting resin including glass transition temperature (Tg ≥ 170°C), dielectric loss factor (tan δ ≤ 0.030 at 100-175°C), and relative dielectric constant change (Δεr ≤ 0.10 at 100-175°C). These parameter specifications ensure the resin maintains low dielectric loss and stable insulating properties at high temperatures while providing adequate thermal conductivity for semiconductor device operation.
Solution Approach 2:
The patent creates a composite material system combining specifically selected thermosetting resin with inorganic filler material. The composite structure leverages the thermal conductivity of inorganic fillers while the thermosetting resin matrix provides the insulating properties. The resin's controlled ion content and molecular structure prevent conductive component release, maintaining insulation reliability even at elevated temperatures up to 175°C.
2Temperature
If inorganic filler material is dispersed in thermosetting resin to enhance thermal conductivity, then heat dissipation is improved, but release of conductive components increases at high temperatures
Solution Approach 1:
The patent specifies critical parameters for the thermosetting resin including glass transition temperature of 170°C or higher, dielectric loss factor of 0.030 or lower at 100-175°C, and controlled ion content. These parameter constraints prevent the resin from degrading and releasing conductive components at operating temperatures, while still allowing effective heat dissipation through the inorganic filler dispersion.
Solution Approach 2:
The patent employs a thermosetting resin with controlled molecular structure and crosslinking that prevents conductive component release. The resin acts as a stable, non-degradable matrix that permanently binds inorganic fillers, preventing their release even under thermal stress. This eliminates the need for additional protective measures against filler migration or resin degradation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermally conductive sheet effectively maintains excellent insulating properties at high temperatures, ensuring the stability and reliability of semiconductor devices by suppressing the release of conductive components and improving thermal radiation properties.
Implementation Method 1
a thermally conductive sheet is developed using a thermosetting resin and inorganic filler material, optimized to have a low dielectric loss factor and relative dielectric constant, with a high glass transition temperature and controlled ion content, to enhance thermal conductivity and insulating properties
Implementation Method 2
maintains excellent insulating properties at high temperatures, ensuring the stability and reliability of semiconductor devices
Data Source
Figure 1~2
AI summary
A thermally conductive sheet of the present invention includes a thermosetting resin (A) and an inorganic filler material (B) that is dispersed in the thermosetting resin (A). In the thermally conductive sheet of the present invention, at a frequency of 1 kHz and at a temperature of 100°C to 175°C, the maximum value of a dielectric loss factor of a cured product of the thermally conductive sheet is less than or equal to 0.030, and a change in relative dielectric constant of the cured product of the thermally conductive sheet is less than or equal to 0.10.