Thermally Conductive Sheet with Optimized Elastic Modulus
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Solution Overview
Problem
Existing thermally conductive sheets fail to meet the demands of recent electronic devices with increased heat generation and size reduction, requiring improved thermal conductivity and step followability, especially when mounted on surfaces with steps.
Innovation Solution
A thermally conductive sheet with a storage elastic modulus of 0.3×10^9 to 1.2×10^9 Pa, thermal resistance of 0.07 to 0.12 K/W, and BN orientation degree of 6 to 70, containing a silicone resin, unreacted silicone oil, and spherical fillers, including aggregated boron nitride particles, is developed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the thermal conductivity is increased by using ceramic powder filled resin, then the heat dissipation performance is improved, but the rigidity and step followability deteriorate
Solution Approach 1:
The invention changes the key parameter of storage elastic modulus to a specific range (0.3×10^9 to 1.2×10^9 Pa) to achieve optimal balance between thermal conductivity and step followability. This parameter optimization allows the material to be soft enough to conform to stepped surfaces while maintaining sufficient structural integrity and heat dissipation capability.
Solution Approach 2:
The invention uses composite materials consisting of silicone resin or epoxy resin combined with ceramic powder (such as boron nitride). This composite structure enables the material to simultaneously achieve high thermal conductivity from the ceramic filler while maintaining appropriate flexibility and step followability through the resin matrix.
2Volume of moving object
If the electronic devices are miniaturized, then the device size is reduced, but the heat generation increases and thermal management becomes more difficult
Solution Approach 1:
The invention optimizes the storage elastic modulus parameter within a specific range to enhance thermal conductivity while maintaining material flexibility. This parameter control enables effective heat dissipation in miniaturized devices where heat generation is concentrated in smaller volumes.
Solution Approach 2:
The invention incorporates ceramic powder fillers (such as boron nitride particles) within the resin matrix, creating a composite structure with enhanced thermal conduction pathways. This porous composite structure allows efficient heat transfer from heat-generating components while maintaining the compact form factor required for miniaturized devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sheet achieves enhanced thermal conductivity and step followability, meeting the demands of modern electronic devices with improved flexibility and insulation properties.
Implementation Method 1
a thermally conductive sheet having a storage elastic modulus of 0.3×10^9 to 1.2×10^9 Pa and a thermal resistance of 0.07 to 0.12 K/W
Data Source
Figure 1
AI summary
A thermally conductive sheet of the present invention has a storage elastic modulus of 0.3×109 to 1.2×109 Pa and a thermal resistance of 0.07 to 0.12 K/W measured when a fastening torque is 0.5 N·m. According to the present invention, it is possible to provide a thermally conductive sheet excellent in thermal conductivity and step followability.