Thermally Conductive Structure in Semiconductor Package
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Solution Overview
Problem
Conventional semiconductor packages face issues with excess cost, poor thermal performance, decreased reliability, and large package sizes, limiting their effectiveness and manufacturing flexibility.
Innovation Solution
A packaged electronic device structure and method that incorporates a separate thermally conductive structure within a package body, allowing for enhanced thermal performance by attaching it to a pad or electronic component, and encapsulating it within a package body to improve heat transfer and manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional semiconductor package structure is used, then the manufacturing process is simple, but the thermal performance is poor
Solution Approach 1:
The package structure is segmented into distinct functional components: a substrate, a separate thermally conductive structure, and an electronic component. This segmentation allows the thermal conduction function to be independently optimized through the dedicated thermally conductive structure while maintaining manufacturing feasibility through standardized assembly processes.
Solution Approach 2:
A separate thermally conductive structure is introduced as an intermediary component between the substrate and the electronic component. This intermediary element specifically addresses thermal management needs without requiring complete redesign of the entire package structure, enabling improved thermal performance while maintaining compatibility with existing manufacturing workflows.
2Volume of stationary object
If the package size is reduced, then the integration density increases, but the thermal dissipation capability decreases
Solution Approach 1:
The thermally conductive structure extends in the vertical dimension (thickness direction) rather than requiring increased lateral footprint. This dimensional approach allows enhanced thermal dissipation capability through increased thermal conduction path length and surface area in the thickness direction, while maintaining a compact lateral package footprint for high integration density.
3Temperature
If a separate thermally conductive structure is added, then the thermal performance is improved, but the manufacturing complexity increases
Solution Approach 1:
The manufacturing process is segmented into distinct stages: substrate preparation, separate thermally conductive structure fabrication, electronic component attachment, and final assembly. This segmentation enables each component to be optimized and manufactured using specialized processes, then assembled using standardized techniques, thereby managing overall manufacturing complexity while achieving superior thermal performance.
Solution Approach 2:
The separate thermally conductive structure is designed with universal attachment interfaces that can be integrated into existing semiconductor manufacturing workflows. The structure serves multiple functions including thermal conduction, mechanical support, and electrical isolation, reducing the need for additional specialized manufacturing steps and maintaining ease of manufacture.
4Strength
If the thermally conductive structure is fully encapsulated, then the structural integrity is improved, but the thermal performance decreases
Solution Approach 1:
The package structure implements local quality differentiation: the thermally conductive structure is encapsulated in regions where structural integrity is needed (lateral sides and bottom) while leaving the top surface exposed where thermal dissipation is required. This selective encapsulation approach maintains structural integrity through the package body while preserving thermal performance through exposed thermal conduction surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved thermal performance, increased reliability, and cost-effectiveness by exposing thermally conductive structures to the package body, enhancing heat transfer and simplifying manufacturing processes while accommodating various interconnect schemes.
Implementation Method 1
a separate thermally conductive structure at least partially encapsulated within a package body... the thermally conductive structure is attached to a pad bottom surface... providing enhanced thermal performance
Data Source
AI summary
A method for forming a packaged electronic device includes providing a substrate comprising a lead and a pad. The method includes attaching a thermally conductive structure to the pad and attaching an electronic component to one of the thermally conductive structure or the pad. The method includes electrically coupling the electronic component to the lead, and forming a package body that encapsulates the electronic component and at least portions of the lead, the pad, and the thermally conductive structure, wherein the package body has a first major surface and a second major surface opposite to the first major surface, and one of the first bottom surface of the thermally conductive structure or the bottom surface of the pad is exposed in the first major surface of the package body.