Thermally Conductive Wire Structure for AMOLED Heat Dissipation
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Solution Overview
Problem
In AMOLED display panels, the application of high voltage during the aging process can cause excessive heat buildup in wires with low thermal conductivity, leading to burns or peeling off of insulating layers, particularly in gate wires made of molybdenum, which affects the display panel's integrity.
Innovation Solution
A wire structure is introduced with a thermally conductive layer having a higher thermal conductivity than the first wire layer, positioned above the first wire layer to enhance heat dissipation, using materials like aluminum, copper, or silver, and optionally including insulating layers to prevent short-circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high voltage is applied during the aging process, then TFT characteristics can be improved, but excessive heat is generated causing burns or peeling of insulating layers
Solution Approach 1:
A thermally conductive layer is introduced as an intermediary component between the first wire layer and the environment. This layer mediates heat transfer from the wire structure to the surrounding areas, enabling effective heat dissipation while maintaining the electrical functionality of the original wire layer. The thermally conductive layer acts as a heat conduit that separates the heat generation source from the sensitive insulating layers.
Solution Approach 2:
The thermal conductivity parameter of the wire structure is changed by adding a material with high thermal conductivity (greater than 200 W/(m·K)) in the thermally conductive layer. This parameter change transforms the wire structure from a poor heat conductor to an efficient heat dissipation path, allowing the system to handle high voltage aging processes without excessive heat accumulation.
2Temperature
If a thermally conductive layer is added above the first wire layer, then heat dissipation is improved, but the device structure becomes more complex
Solution Approach 1:
The thermally conductive layer is designed to serve multiple functions simultaneously: it provides thermal conduction for heat dissipation, acts as a structural support layer, and can be integrated with existing manufacturing processes. By making the layer multi-functional, the patent reduces the need for additional separate components, thereby limiting the increase in device complexity.
3Stability of the object's composition
If high voltage is applied to eliminate bright spots, then display uniformity is improved, but the risk of burning or peeling increases
Solution Approach 1:
The thermally conductive layer is positioned and configured before the high voltage aging process is applied, serving as a preventive heat management system. This layer provides beforehand cushioning by establishing efficient heat dissipation pathways in advance, preventing heat accumulation that would otherwise cause burns or peeling of insulating layers during the high voltage aging process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved heat dissipation effectively reduces the risk of burns or peeling off of insulating layers, ensuring the display panel's reliability and maintaining pixel area functionality during the aging process.
Implementation Method 1
a thermally conductive layer above the first wire layer, wherein a thermal conductivity of the thermally conductive layer is greater than a thermal conductivity of the first wire layer
Data Source
AI summary
The present disclosure provides a wire structure for a display panel, a display panel, a display device, and a manufacturing method. The wire structure includes a first wire layer and a thermally conductive layer above the first wire layer. A thermal conductivity of the thermally conductive layer is greater than a thermal conductivity of the first wire layer.